Publication detail

Flux effect on void quantity and size in soldered joints

D. Bušek, K. Dušek, D. Růžička, M. Plaček, P. Mach, J. Urbánek, J. Starý

Original Title

Flux effect on void quantity and size in soldered joints

Type

journal article in Web of Science

Language

English

Original Abstract

Article is focused on both macro and microvoids in soldered joints and the use of additional flux to reduce their frequency and minimize their negative effect on the soldered joint reliability. In total five fluxes were used, three were gel based (NC559, MTV-125R, TSF-6516) and two of them were liquid based (Topnik G-5, JBC FL-15). They were used within two solder pastes, both lead and lead-free. The reflow process was identical for all of the combinations and was within the range of manufacturer recommended profiles. The amount of voids was evaluated using X-ray analysis. It was found that the use of increased amount of proper flux, specifically flux with higher activity, in the solder paste may significantly lower the void occurrence.

Keywords

Assembly manufacturing, reliability, soldering, voids, flux

Authors

D. Bušek, K. Dušek, D. Růžička, M. Plaček, P. Mach, J. Urbánek, J. Starý

Released

1. 5. 2016

Location

Nizozemsko

ISBN

0026-2714

Periodical

Microelectronics Reliability

Number

60

State

United Kingdom of Great Britain and Northern Ireland

Pages from

135

Pages to

140

Pages count

6

BibTex

@article{BUT131617,
  author="David {Bušek} and Karel {Dušek} and Daniel {Růžička} and Martin {Plaček} and Pavel {Mach} and Jan {Urbánek} and Jiří {Starý}",
  title="Flux effect on void quantity and size in soldered joints 

",
  journal="Microelectronics Reliability",
  year="2016",
  number="60",
  pages="135--140",
  doi="10.1016/j.microrel.2016.03.009",
  issn="0026-2714"
}