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BULVA, J., NOVOTNÝ, M., SZENDIUCH, I.
Original Title
Investigation of Lead-Free Solder Joints Reliability by Thermal Modelling
Type
conference paper
Language
English
Original Abstract
This paper describes theory of solder joint reliability and thermomechanical modelling of connection of two different materials, which are often used in electronic devices – organics FR4 and two ceramics material Al2O3 and AlN. There are investigated combinations organic-organic, organic-ceramic, ceramic-ceramic, connected with eutectic SnPb solder or lead free solder SnAgCu.
Key words in English
ANSYS, modelling, reliability, Lead-free
Authors
RIV year
2005
Released
1. 1. 2005
Publisher
IMAPS BENELUX
Location
Brugge, Belgium
Pages from
546
Pages to
1095
Pages count
550
BibTex
@inproceedings{BUT14828, author="Jindřich {Bulva} and Marek {Novotný} and Ivan {Szendiuch}", title="Investigation of Lead-Free Solder Joints Reliability by Thermal Modelling", booktitle="15th European Microelectronics and Packaging Conference & Exhibition", year="2005", pages="550", publisher="IMAPS BENELUX", address="Brugge, Belgium" }