Publication detail

Study of behaviour of thermal insulation materials under extremely low pressure

ZACH, J. PETERKOVÁ, J. BUBENÍK, J.

Original Title

Study of behaviour of thermal insulation materials under extremely low pressure

Type

conference paper

Language

English

Original Abstract

In most thermal insulation materials, reduced internal pressure improves thermal insulation properties. It reduces heat transport by convection as well as heat conduction in gases in the material´s pore structure. The dependence of thermal conductivity on pressure is individual to every type of insulation with open porosity. In general, a material with fine porosity is not very sensitive to pressure change within the range of very low pressure to vacuum. On the other hand, materials with a larger number of bigger pores are more sensitive to changing pressure. Any pressure change between atmosphere pressure and vacuum causes a change in thermal conductivity. The paper presents the results of an investigation into the behaviour of alternative fibrous insulations usable in the production of vacuum insulation panels at low pressure.

Keywords

Thermal insulation materials; porosity; vacuum; low pressure; thermal conductivity.

Authors

ZACH, J.; PETERKOVÁ, J.; BUBENÍK, J.

Released

2. 9. 2019

Publisher

EDP Sciences

Location

Francie

ISBN

2261-236X

Periodical

MATEC Web of Conferences

Year of study

282

Number

1

State

French Republic

Pages from

1

Pages to

6

Pages count

6

URL

Full text in the Digital Library

BibTex

@inproceedings{BUT158999,
  author="Jiří {Zach} and Jitka {Peterková} and Jan {Bubeník}",
  title="Study of behaviour of thermal insulation materials under extremely low pressure",
  booktitle="4th Central European Symposium on Building Physics (CESBP 2019)",
  year="2019",
  journal="MATEC Web of Conferences",
  volume="282",
  number="1",
  pages="1--6",
  publisher="EDP Sciences",
  address="Francie",
  doi="10.1051/matecconf/201928202044",
  issn="2261-236X",
  url="https://www.matec-conferences.org/articles/matecconf/pdf/2019/31/matecconf_cesbp2019_02044.pdf"
}