Publication detail

Comparing of 2D and 3D Modeling of MSM

BULVA, J., SZENDIUCH, I.

Original Title

Comparing of 2D and 3D Modeling of MSM

Type

conference paper

Language

English

Original Abstract

This article focuses on thermomechanical modelling of connection of two different materials, which are often used in electronic devices – FR4 and ceramic material Al2O3. There are investigated combinations FR4-FR4, FR4-ceramic, ceramic-ceramic, connected with eutectic SnPb solder and Lead Free solders (SnAg, SnAgCu). In the first step, 2D modelling was used. This approach is simpler for model creating and more unpretentious for computing time than 3D modelling, which is used after.

Key words in English

ANSYS, solder joint reliability

Authors

BULVA, J., SZENDIUCH, I.

RIV year

2005

Released

2. 2. 2005

Publisher

IEEE

Location

Tarragona, Spain

ISBN

0-7803-8811-9

Book

2005 Spanish Conference on Electron Devices

Pages from

1

Pages to

3

Pages count

3

BibTex

@inproceedings{BUT16786,
  author="Jindřich {Bulva} and Ivan {Szendiuch}",
  title="Comparing of 2D and 3D Modeling of MSM",
  booktitle="2005 Spanish Conference on Electron Devices",
  year="2005",
  pages="3",
  publisher="IEEE",
  address="Tarragona, Spain",
  isbn="0-7803-8811-9"
}