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BULVA, J., SZENDIUCH, I.
Original Title
Comparing of 2D and 3D Modeling of MSM
Type
conference paper
Language
English
Original Abstract
This article focuses on thermomechanical modelling of connection of two different materials, which are often used in electronic devices – FR4 and ceramic material Al2O3. There are investigated combinations FR4-FR4, FR4-ceramic, ceramic-ceramic, connected with eutectic SnPb solder and Lead Free solders (SnAg, SnAgCu). In the first step, 2D modelling was used. This approach is simpler for model creating and more unpretentious for computing time than 3D modelling, which is used after.
Key words in English
ANSYS, solder joint reliability
Authors
RIV year
2005
Released
2. 2. 2005
Publisher
IEEE
Location
Tarragona, Spain
ISBN
0-7803-8811-9
Book
2005 Spanish Conference on Electron Devices
Pages from
1
Pages to
3
Pages count
BibTex
@inproceedings{BUT16786, author="Jindřich {Bulva} and Ivan {Szendiuch}", title="Comparing of 2D and 3D Modeling of MSM", booktitle="2005 Spanish Conference on Electron Devices", year="2005", pages="3", publisher="IEEE", address="Tarragona, Spain", isbn="0-7803-8811-9" }