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Přikryl, R., Čech, V., Hedbavny, P.
Original Title
Capacitive coupling plasma system for thin film deposition
Type
conference paper
Language
English
Original Abstract
Plasma polymerization is a powerful tool for deposition of thin films whose physicochemical properties can be controlled in wide ranges and thus the technology enables tailoring of the material with respect to an application. However, a success of the coating technique depends on a suitable technological system, as the vacuum quality and film reproducibility are the crucial parameters. We have developed a new capacitive coupling system for creative design and application of complex film systems in smart materials. The internal setup of our deposition chamber using plan-parallel electrodes was derived from a typical capacitive coupling system, but our apparatus was equipped with many non-standard components.
Keywords
PECVD, plasma technology, capacitive coupling system
Authors
RIV year
2004
Released
1. 1. 2004
Location
Itálie
Pages from
96
Pages to
97
Pages count
1
BibTex
@inproceedings{BUT17610, author="Radek {Přikryl} and Vladimír {Čech} and Pavel {Hedbavny}", title="Capacitive coupling plasma system for thin film deposition", booktitle="1st Workshop {"}Structuring of Polymers{"}", year="2004", pages="96--97", address="Itálie" }