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Publication detail
Szendiuch,I.
Original Title
Moderní trendy pouzdření v mikroelektronice
English Title
Modern Trends in Electronics Packaging
Type
conference paper
Language
Czech
Original Abstract
MSM a PoP jako nové směry ve vývoji moderních pouzder jsou popsány
English abstract
MSM and PoP as new trends in electronics packaging are described
Keywords
MSM, PoP, pouzdření
Key words in English
MSM, PoP, packaging
Authors
RIV year
2006
Released
17. 10. 2006
Publisher
SMT info konsorcium
Location
Brno
ISBN
1211-6947
Periodical
Bulletin of SMT/ISHM Int. Conference "New Trends in Microelectronics"
Year of study
Number
55
State
Czech Republic
Pages from
26
Pages to
30
Pages count
5
BibTex
@inproceedings{BUT20175, author="Ivan {Szendiuch}", title="Moderní trendy pouzdření v mikroelektronice", booktitle="Pájení a tepelné procesy", year="2006", journal="Bulletin of SMT/ISHM Int. Conference {"}New Trends in Microelectronics{"}", volume="2006", number="55", pages="5", publisher="SMT info konsorcium", address="Brno", issn="1211-6947" }