Publication detail

Phase change material for thermal management of IC packages

FIALA, P. STEINBAUER, M.

Original Title

Phase change material for thermal management of IC packages

Type

conference paper

Language

English

Original Abstract

This paper deals with the application of phase change materials (PCM) for thermal management of integrated circuits as a viable alternative to active forced convection cooling systems.The paper presents an analytical description and solution of heat transfer, melting and freezing process in 1D which is applied to inorganic crystalline salts. There are also results of numerical simulation of real 3D model. These results were obtained by means of the finite element method (FEM). Results of 3D numerical solutions were verified experimentally.

Keywords

phase change, FEM, heat, integrated circuit

Authors

FIALA, P.; STEINBAUER, M.

RIV year

2007

Released

10. 9. 2007

Publisher

University of West Bohemia

Location

Plzeň

ISBN

978-80-7043-564-9

Book

AMTEE 07

Pages from

3

Pages to

4

Pages count

2

BibTex

@inproceedings{BUT23674,
  author="Pavel {Fiala} and Miloslav {Steinbauer}",
  title="Phase change material for thermal management of IC packages",
  booktitle="AMTEE 07",
  year="2007",
  pages="3--4",
  publisher="University of West Bohemia",
  address="Plzeň",
  isbn="978-80-7043-564-9"
}