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Publication detail
SZENDIUCH, I.
Original Title
Roadmap of Lead-free Soldering
Type
conference paper
Language
English
Original Abstract
lead-free soldering - overwiev of factors that has impact on lead free soldering process and life-time
Keywords
lead- free soldering, solders, fluxes, reliability, life-time
Authors
RIV year
2007
Released
7. 5. 2007
Publisher
TU Dresden
Location
Cluj-Napoca
ISBN
978-973-713-174-4
Book
Proceedings ISSE 2007
Edition
1
Edition number
Pages from
55
Pages to
60
Pages count
6
BibTex
@inproceedings{BUT28355, author="Ivan {Szendiuch}", title="Roadmap of Lead-free Soldering", booktitle="Proceedings ISSE 2007", year="2007", series="1", number="1", pages="55--60", publisher="TU Dresden", address="Cluj-Napoca", isbn="978-973-713-174-4" }