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SZENDIUCH, I. HEJÁTKOVÁ, E. NOVOTNÝ, M.
Original Title
Effect of Lead-free Conductive Thick Film Materials on Ultrasonic Wire Bondability
Type
conference paper
Language
English
Original Abstract
deals with influence of lead-free thick film conductive materials on wire bonding
Keywords
lead-free, wire bonding
Authors
SZENDIUCH, I.; HEJÁTKOVÁ, E.; NOVOTNÝ, M.
RIV year
2007
Released
9. 5. 2007
Publisher
TU Dresden
Location
Cluj-Napoca
Pages from
124
Pages to
129
Pages count
6
BibTex
@inproceedings{BUT28357, author="Ivan {Szendiuch} and Edita {Hejátková} and Marek {Novotný}", title="Effect of Lead-free Conductive Thick Film Materials on Ultrasonic Wire Bondability", booktitle="Proceedings ISSE 2007", year="2007", pages="124--129", publisher="TU Dresden", address="Cluj-Napoca" }