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ADÁMEK, M. PRÁŠEK, J. NICÁK, M.
Original Title
The students' workplace for special components soldering and inspection
Type
conference paper
Language
English
Original Abstract
Expansion of microelectronics technologies is very fast. An education on high schools and universities must be conformed to these new trends and new technologies, which are a base for new education methods. This paper is focused to the problematic of interconnections and the implementation of new trends of modern soldering technologies and modern equipment into education process; concretely in courses, which are specialized to modern technologies of electronic circuits and systems. The possibilities of 3-D structures and soldering of BGA components using own prepared samples are presented. Samples are made from ceramic and organic materials. The solder paste was deposited to the samples by stencil printing techniques and samples were assembled using Fritch microplacer and soldered using vapor phase soldering device Asscon Quicky 300. The final inspection was made by optical inspection device Ersascope. Finally it was found that this process is suitable for practical education.
Keywords
education, BGA, soldering, 3-D packaging
Authors
ADÁMEK, M.; PRÁŠEK, J.; NICÁK, M.
RIV year
2009
Released
2. 9. 2009
Publisher
NOVPRESS s.r.o.
Location
Brno
ISBN
978-80-214-3933-7
Book
EDS '09 IMAPS CS International Conference Proceedings
Pages from
392
Pages to
396
Pages count
5
BibTex
@inproceedings{BUT29593, author="Martin {Adámek} and Jan {Prášek} and Michal {Nicák}", title="The students' workplace for special components soldering and inspection", booktitle="EDS '09 IMAPS CS International Conference Proceedings", year="2009", pages="392--396", publisher="NOVPRESS s.r.o.", address="Brno", isbn="978-80-214-3933-7" }