Publication detail

CONTRIBUTION TO LEAD-FREE SOLDERED 3D STRUCTURES

NICÁK, M. SZENDIUCH, I.

Original Title

CONTRIBUTION TO LEAD-FREE SOLDERED 3D STRUCTURES

Type

conference paper

Language

English

Original Abstract

This paper describes design, construction and some test results of lead-free soldered three dimensional structures based on combination of stacked thick-film Al2O3 and FR-4 substrates. These various substrate configurations are realized in two ways, at first by lead-free solder bumps made by solder paste stencil printing, and at second by bumps using combination of paste and solder balls.

Keywords

packaging, stacking, 3D structures, lead-free, thick-film

Authors

NICÁK, M.; SZENDIUCH, I.

RIV year

2010

Released

22. 4. 2010

Publisher

Publishing House of ISTU

Location

Izhevsk, Russia

ISBN

978-5-7526-0442-3

Book

Second Forum of Young Researchers. In the framework of International Forum "Education Quality - 2010" : Proceedings

Pages from

378

Pages to

382

Pages count

444

BibTex

@inproceedings{BUT33965,
  author="Michal {Nicák} and Ivan {Szendiuch}",
  title="CONTRIBUTION TO LEAD-FREE SOLDERED 3D STRUCTURES",
  booktitle="Second Forum of Young Researchers. In the framework of International Forum {"}Education Quality - 2010{"} : Proceedings",
  year="2010",
  pages="378--382",
  publisher="Publishing House of ISTU",
  address="Izhevsk, Russia",
  isbn="978-5-7526-0442-3"
}