Přístupnostní navigace
E-application
Search Search Close
Publication detail
NICÁK, M. ŠVECOVÁ, O. ŠANDERA, J. PULEC, J. SZENDIUCH, I.
Original Title
Reliability and Simulation of Lead-Free Solder Joint Behavior in 3D Packaging Structure
Type
conference paper
Language
English
Original Abstract
This paper deals with behavior of lead-free solder joint applied in 3D electronic packaging structure. There are plenty of factors which influences reliability and life-time of solder compound connection. Type of substrates, selection of materials and process arrangement are the main areas to investigate. The content consists from three main parts. The first deals with introduction of designed test pattern, material, and process arrangement and applied testing methods. Second part continues with ANSYS software simulation of solder interconnections during thermo-mechanical stress tests and third part is aimed to experimental evaluation of results in the comparison to simulated results.
Keywords
3D Packaging, ANSYS, Lead-free, Reliability, Solder joint
Authors
NICÁK, M.; ŠVECOVÁ, O.; ŠANDERA, J.; PULEC, J.; SZENDIUCH, I.
RIV year
2011
Released
12. 1. 2011
Publisher
Trans Tech Publications
Location
Švýcarsko
ISBN
978-3-03785-006-0
Book
Key Engineering Materials Vol. 465 (2011)
1013-9826
Periodical
Key Engineering Materials (print)
Year of study
465
Number
491
State
Swiss Confederation
Pages from
Pages to
494
Pages count
4
URL
http://www.scientific.net/KEM.465.491
BibTex
@inproceedings{BUT36015, author="Michal {Nicák} and Olga {Švecová} and Josef {Šandera} and Jiří {Pulec} and Ivan {Szendiuch}", title="Reliability and Simulation of Lead-Free Solder Joint Behavior in 3D Packaging Structure", booktitle="Key Engineering Materials Vol. 465 (2011)", year="2011", journal="Key Engineering Materials (print)", volume="465", number="491", pages="491--494", publisher="Trans Tech Publications", address="Švýcarsko", isbn="978-3-03785-006-0", issn="1013-9826", url="http://www.scientific.net/KEM.465.491" }