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Publication detail
SZENDIUCH, I.
Original Title
Chip Level Packaging - New Way to Higher Integration
Type
journal article - other
Language
English
Original Abstract
see paper
Key words in English
chip level packaging, integration
Authors
RIV year
2002
Released
23. 6. 2001
Pages from
9
Pages to
14
Pages count
6
BibTex
@{BUT70869 }