Publication detail

Stability of Microstructure of Ultrafine-Grained Copper Under Fatigue and Thermal Exposition

KUNZ, L. LUKÁŠ, P. PANTĚLEJEV, L. MAN, O.

Original Title

Stability of Microstructure of Ultrafine-Grained Copper Under Fatigue and Thermal Exposition

Type

journal article - other

Language

English

Original Abstract

Effect of cyclic loading and thermal exposition on microstructure of bulk ultrafinegrained Cu prepared by equal channel angular pressing was experimentally investigated by means of electron backscattering diffraction and by transmission electron microscopy. Stability of the microstructure under stress-controlled cyclic loading with a tensile mean stress of 200 MPa was shown to be high. Neither dynamic grain coarsening nor development of bimodal microstructure was observed. However, annealing at 250 C for 30 min resulted in formation of bimodal microstructure. Consequently, fatigue strength of annealed specimens was low.

Keywords

equal channel angular pressing, fatigue, stability of microstructure, ultrafine-grained copper

Authors

KUNZ, L.; LUKÁŠ, P.; PANTĚLEJEV, L.; MAN, O.

RIV year

2011

Released

1. 12. 2011

Publisher

Blackwell Publishing Ltd

Location

New Delhi

ISBN

0039-2103

Periodical

STRAIN

Year of study

47

Number

6

State

United Kingdom of Great Britain and Northern Ireland

Pages from

476

Pages to

482

Pages count

7

BibTex

@article{BUT48103,
  author="Ludvík {Kunz} and Petr {Lukáš} and Libor {Pantělejev} and Ondřej {Man}",
  title="Stability of Microstructure of Ultrafine-Grained Copper Under Fatigue and Thermal Exposition",
  journal="STRAIN",
  year="2011",
  volume="47",
  number="6",
  pages="476--482",
  issn="0039-2103"
}