Publication detail

New trends of BGA Soldering in education

ADÁMEK, M. PRÁŠEK, J. NICÁK, M.

Original Title

New trends of BGA Soldering in education

Type

journal article - other

Language

English

Original Abstract

This paper deals with the problematic of modern soldering technologies and the implementation of new trends of modern soldering technologies into education process. It describes the possibilities of implementation of modern equipment in the education process, concretely in courses specialized to modern technologies of electronic circuits and systems. The possibilities of 3-D structures and BGA soldering using own prepared ceramic and organic based samples were presented. The samples with deposited solder paste using stencil printing techniques were assembled using Fritch microplacer and soldered using vapor phase soldering device Asscon Quicky 300. The final inspection of soldered joints was made using Ersascope special optical inspection device. Finally it was found that this process is suitable for practical education in the lessons of modern packaging and systems subjects.

Keywords

Education, BGA, Soldering, 3-D packaging

Authors

ADÁMEK, M.; PRÁŠEK, J.; NICÁK, M.

RIV year

2009

Released

14. 9. 2009

Publisher

Technical University of Sofia

Location

Sofia, Bulgaria

ISBN

1313-1842

Periodical

Electronics

Year of study

3

Number

2

State

Republic of Bulgaria

Pages from

26

Pages to

28

Pages count

3

BibTex

@article{BUT48881,
  author="Martin {Adámek} and Jan {Prášek} and Michal {Nicák}",
  title="New trends of BGA Soldering in education",
  journal="Electronics",
  year="2009",
  volume="3",
  number="2",
  pages="26--28",
  issn="1313-1842"
}