Přístupnostní navigace
E-application
Search Search Close
Publication detail
SZENDIUCH, I.
Original Title
Development in Electronic Packaging - Moving to 3D System Configuration
Type
journal article - other
Language
English
Original Abstract
There is described development in the electronics packaging, which moving towards 3D configurations.
Keywords
packaging, 3D structures, interconnection
Authors
RIV year
2011
Released
1. 4. 2011
Publisher
Czech and Slovak Universities
Location
Czech Republic
ISBN
1210-2512
Periodical
Radioengineering
Year of study
April 2011
Number
1
State
Pages from
214
Pages to
220
Pages count
7
BibTex
@article{BUT50420, author="Ivan {Szendiuch}", title="Development in Electronic Packaging - Moving to 3D System Configuration", journal="Radioengineering", year="2011", volume="April 2011", number="1", pages="214--220", issn="1210-2512" }