Publication detail

Development in Electronic Packaging - Moving to 3D System Configuration

SZENDIUCH, I.

Original Title

Development in Electronic Packaging - Moving to 3D System Configuration

Type

journal article - other

Language

English

Original Abstract

There is described development in the electronics packaging, which moving towards 3D configurations.

Keywords

packaging, 3D structures, interconnection

Authors

SZENDIUCH, I.

RIV year

2011

Released

1. 4. 2011

Publisher

Czech and Slovak Universities

Location

Czech Republic

ISBN

1210-2512

Periodical

Radioengineering

Year of study

April 2011

Number

1

State

Czech Republic

Pages from

214

Pages to

220

Pages count

7

BibTex

@article{BUT50420,
  author="Ivan {Szendiuch}",
  title="Development in Electronic Packaging - Moving to 3D System Configuration",
  journal="Radioengineering",
  year="2011",
  volume="April 2011",
  number="1",
  pages="214--220",
  issn="1210-2512"
}