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SZENDIUCH, I., ŠANDERA, J., BÍLEK, J.
Original Title
Multi Substrate Modules – Cheap Solution for 3D Packaging
Type
conference paper
Language
English
Original Abstract
The stacked packages are one of the most significant advances for building modern electronic systems. They give a good opportunity to built high volume three-dimensional devices with requested quality. 3D packages deliver volumetric density through vertical stacking. This method integrates multiple substrates and chips in a package to provide higher levels of functionality that can be achieved through multiple package solutions technologies. The aim of this paper is to describe and discuss some of the possible solutions, which are currently followed by research project of the Czech Ministry of Education in the frame of Research Plan MSM 262200022 “MIKROSYT Microelectronic Systems and Technologies”, and at the same time by the Grant project FRVS IS 421920 “Innovation of Education of Microelectronics Assembly Technologies”.
Key words in English
3D structures, Stacking, Multi Substrate Modules (MSM), Ball-terminal, Edge-terminal
Authors
RIV year
2002
Released
29. 9. 2002
Publisher
Pelkosen Painotuote
Location
Kiiminki, Finland
ISBN
951-98002-4-7
Book
Proceedings of The IMAPS Nordic Annual Conference Stockholm, 2002
Pages from
114
Pages to
235
Pages count
122
BibTex
@inproceedings{BUT5147, author="Ivan {Szendiuch} and Josef {Šandera} and Jaromír {Bílek}", title="Multi Substrate Modules – Cheap Solution for 3D Packaging", booktitle="Proceedings of The IMAPS Nordic Annual Conference Stockholm, 2002", year="2002", pages="122", publisher="Pelkosen Painotuote", address="Kiiminki, Finland", isbn="951-98002-4-7" }