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Publication detail
PSOTA, B. SZENDIUCH, I.
Original Title
Modeling of Microelectronic Structures and Packages using ANSYS Software
Type
conference proceedings
Language
English
Original Abstract
This paper informing about the modeling of BGA structures using ANSYS software. The FEA method is cleared up, but the main emphasis lays on mechanical stress issues. As example is shown the comparison of three different solders and described their usage for electronic components.
Keywords
Mechanical stress, ANSYS, BGA, Simulation
Authors
PSOTA, B.; SZENDIUCH, I.
Released
16. 5. 2011
ISBN
978-1-4577-2111-3
BibTex
@proceedings{BUT73010, editor="Boleslav {Psota} and Ivan {Szendiuch}", title="Modeling of Microelectronic Structures and Packages using ANSYS Software", year="2011", isbn="978-1-4577-2111-3" }