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BULVA, J., SZENDIUCH, I.
Original Title
Modelling of 3D Multimodule Substrate
Type
conference paper
Language
English
Original Abstract
Electronic assembly tries to reach low cost and very fast design-to-production process. The stacked packages are one of possible ways of solution. This article focuses on thermomechanical modelling of two materials with different CTE, which are commonly used in today’s electronic devices – FR4 and ceramic material 96%Al2O3. These substrates are connected with lead free solder SnAgCu. ANSYS software is used and results from several analyses are discussed. One of the main purposes is a comparison of thermomechanical properties of MSMs when solder bumps changed diameter.
Key words in English
MSM, reliability, thermomechanical properties, packaging, modelling, ANSYS
Authors
RIV year
2003
Released
1. 1. 2003
Publisher
International Microelectronics and Packaging Society Poland-Chapter
Location
Gliwice, Poland
ISBN
83-917701-0-9
Book
Proceedings of 27-th International Conference and Exhibition IMAPS-Poland 2003
Edition
Neuveden
Edition number
Pages from
126
Pages to
129
Pages count
4
BibTex
@inproceedings{BUT8127, author="Jindřich {Bulva} and Ivan {Szendiuch}", title="Modelling of 3D Multimodule Substrate", booktitle="Proceedings of 27-th International Conference and Exhibition IMAPS-Poland 2003", year="2003", series="Neuveden", volume="Neuveden", number="Neuveden", pages="4", publisher="International Microelectronics and Packaging Society Poland-Chapter", address="Gliwice, Poland", isbn="83-917701-0-9" }