Publication detail

Solder Joint Quality

SZENDIUCH, I., BULVA, J.

Original Title

Solder Joint Quality

Type

conference paper

Language

English

Original Abstract

A physical limit to increasing current density or to decreasing integrated circuit dimension in both microelectronics and power electronics is the performance of solder joint connections and their reliability. It is connected with effect of electromigration and following intermetallic layer growth. Electromigration of solder joint is the major failure phenomenon in integrated circuits, but until recently it was seldom recognized as a reliability concern for solder joints. Actual very significant need of industry is to assure solder production process to produce reliable solder joints. For this it is necessary to understand basic approach to solder joint existence.

Key words in English

Quality

Authors

SZENDIUCH, I., BULVA, J.

RIV year

2003

Released

1. 1. 2003

Publisher

Ing. Zdeněk Novotný, CSc., Brno

Location

Brno

ISBN

80-214-2452-4

Book

Proceedings of 10-th Electronic Devices and Systems Conference 2003

Edition

Neuveden

Edition number

Neuveden

Pages from

388

Pages to

393

Pages count

6

BibTex

@inproceedings{BUT8129,
  author="Ivan {Szendiuch} and Jindřich {Bulva}",
  title="Solder Joint Quality",
  booktitle="Proceedings of 10-th Electronic Devices and Systems Conference 2003",
  year="2003",
  series="Neuveden",
  volume="Neuveden",
  number="Neuveden",
  pages="6",
  publisher="Ing. Zdeněk Novotný, CSc., Brno",
  address="Brno",
  isbn="80-214-2452-4"
}