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SZENDIUCH, I., BULVA, J.
Original Title
Solder Joint Quality
Type
conference paper
Language
English
Original Abstract
A physical limit to increasing current density or to decreasing integrated circuit dimension in both microelectronics and power electronics is the performance of solder joint connections and their reliability. It is connected with effect of electromigration and following intermetallic layer growth. Electromigration of solder joint is the major failure phenomenon in integrated circuits, but until recently it was seldom recognized as a reliability concern for solder joints. Actual very significant need of industry is to assure solder production process to produce reliable solder joints. For this it is necessary to understand basic approach to solder joint existence.
Key words in English
Quality
Authors
RIV year
2003
Released
1. 1. 2003
Publisher
Ing. Zdeněk Novotný, CSc., Brno
Location
Brno
ISBN
80-214-2452-4
Book
Proceedings of 10-th Electronic Devices and Systems Conference 2003
Edition
Neuveden
Edition number
Pages from
388
Pages to
393
Pages count
6
BibTex
@inproceedings{BUT8129, author="Ivan {Szendiuch} and Jindřich {Bulva}", title="Solder Joint Quality", booktitle="Proceedings of 10-th Electronic Devices and Systems Conference 2003", year="2003", series="Neuveden", volume="Neuveden", number="Neuveden", pages="6", publisher="Ing. Zdeněk Novotný, CSc., Brno", address="Brno", isbn="80-214-2452-4" }