Přístupnostní navigace
E-application
Search Search Close
Publication detail
ČECH, V. HOSEIN, H.-A. LASOTA, T. DRZAL, L.
Original Title
Mechanical properties of plasma-polymerized tetravinylsilane films
Type
journal article - other
Language
English
Original Abstract
Continuous stiffness measurement (CSM) and dynamic contact module (DCM) nanoindentation measurements were used to characterize the mechanical properties of plasma-polymerized tetravinylsilane films deposited by PECVD at RF powers ranging from 10 to 70 W. The Youngs modulus and hardness as a function of the indenter displacement (5-500 nm) were investigated for films of 1-micron thickness. The Youngs modulus (hardness) was observed to increase from 8.3 GPa (0.9 GPa) to 58 GPa (9.5 GPa) with enhanced RF power. Nanoindentation analysis together with AFM imaging revealed a grain character of films deposited at a higher power. Finite element analysis was used to simulate nanoindentation measurements and evaluate properties of the elastic-plastic material.
Keywords
mechanical properties; nanoindentation; organosilicon precursors; plasma-enhanced chemical vapor deposition (PECVD); thin films
Authors
ČECH, V.; HOSEIN, H.-A.; LASOTA, T.; DRZAL, L.
RIV year
2011
Released
31. 12. 2011
ISBN
1612-8850
Periodical
Plasma Processes and Polymers
Year of study
8
Number
2
State
Federal Republic of Germany
Pages from
138
Pages to
146
Pages count
9
BibTex
@article{BUT89392, author="ČECH, V. and HOSEIN, H.-A. and LASOTA, T. and DRZAL, L.", title="Mechanical properties of plasma-polymerized tetravinylsilane films", journal="Plasma Processes and Polymers", year="2011", volume="8", number="2", pages="138--146", issn="1612-8850" }