Publication detail

Lead-free Soldering - when will be comming?

SZENDIUCH, I.

Original Title

Lead-free Soldering - when will be comming?

Type

conference paper

Language

English

Original Abstract

The first supposed date for replacing of lead-solders was January 1, 2004. We all can see that the reality is still distant and nobody is sure that it will be actually announced year 2006. There is no current definition of lead-free in electronics industry. However based on environmental restrictions, manufacturer requirements and industrial practice, the amount of lead contained in a lead-free alloy should be less than 0.1%. A large number of lead-free solders have been developed and applications have been made for over 100 patents on various alloy compositions. Although not all these alloys are commercially available there is still a wide range to choose from. Unfortunately within this range of lead-free solders, there is no absolute drop-in replacement for tin-lead alloy. It other words there is no lead-free alloy with the same melting temperature, wetting, cost and strength properties.

Keywords

Solder-Free, Soldering, Factors, Parameters

Authors

SZENDIUCH, I.

RIV year

2003

Released

25. 9. 2003

Publisher

Technological Institute of Crete

Location

Crete, Greece

ISBN

80-214-2461-3

Book

Proceedings of the Socrates Workshop 2003

Pages from

61

Pages to

65

Pages count

5

BibTex

@inproceedings{BUT9233,
  author="Ivan {Szendiuch}",
  title="Lead-free Soldering - when will be comming?",
  booktitle="Proceedings of the Socrates Workshop 2003",
  year="2003",
  volume="2003",
  pages="5",
  publisher="Technological Institute of Crete",
  address="Crete, Greece",
  isbn="80-214-2461-3"
}