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PEKÁREK, J. VRBA, R. PRÁŠEK, J. CHOMOUCKÁ, J.
Original Title
Experimental study of glass frit bonding
Type
conference paper
Language
English
Original Abstract
Glass frit bonding technology provides a wide range of possibilities for the bonding of wafers at process temperatures below 450 C. The process consists of three main steps: screen-printing of the glass paste, thermal conditioning and thermo-compressive bonding. The structured bonding layer protects moveable structures from parasitic bonding. Almost all surface layers commonly used in silicon micromachining can be bonded using glass frits. The main advantages of glass frit bonding are hermetic sealing, high process yield, low mechanical stress at the bonding interface, high bonding strength, and good reliability.
Keywords
Glass frit, wafer bonding
Authors
PEKÁREK, J.; VRBA, R.; PRÁŠEK, J.; CHOMOUCKÁ, J.
RIV year
2012
Released
30. 5. 2012
Publisher
Mendelova univerzita v Brně
Location
Brno
ISBN
978-80-7375-618-5
Book
XII. Pracovní setkání fyzikálních chemiků a elektrochemiků
Edition number
1.
Pages from
214
Pages to
215
Pages count
2
BibTex
@inproceedings{BUT92579, author="Jan {Pekárek} and Radimír {Vrba} and Jan {Prášek} and Jana {Pekárková}", title="Experimental study of glass frit bonding", booktitle="XII. Pracovní setkání fyzikálních chemiků a elektrochemiků", year="2012", number="1.", pages="214--215", publisher="Mendelova univerzita v Brně", address="Brno", isbn="978-80-7375-618-5" }