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Publication detail
KLÍMA, M. SZENDIUCH, I.
Original Title
Possibilities of making 3D resistors in LTCC technology
Type
conference paper
Language
English
Original Abstract
The Article deals with three-dimensional (3D) resistors making in Low Temperature Co-fired Ceramic (LTCC) substrates. It is especially focused on a manner of fabrication and design for reliability and reproducibility. 3D resistors are created of vias filled with a resistive paste. To fill the vias, stencil-printing is used. There are two ways of their arrangement through more layers – directly in line or zigzag. The research targets on finding the optimal count of connected layers, structure of resistive paste after firing, scattering of values of resistivity.
Keywords
LTCC, 3D resistor, resistive vias
Authors
KLÍMA, M.; SZENDIUCH, I.
RIV year
2012
Released
20. 8. 2012
ISBN
978-1-4673-2240-9
Book
Electronics Technology (ISSE), 2012 35th International Spring Seminar on Electronics Technology
Pages from
50
Pages to
54
Pages count
5
BibTex
@inproceedings{BUT93108, author="Martin {Klíma} and Ivan {Szendiuch}", title="Possibilities of making 3D resistors in LTCC technology", booktitle="Electronics Technology (ISSE), 2012 35th International Spring Seminar on Electronics Technology", year="2012", pages="50--54", isbn="978-1-4673-2240-9" }