Soldering station HSR-01 with directly heated template for reballing proces

The HSR-01 soldering station (Figure 1) is an innovative device that uses the basic principle of cheaper methods for reballing BGA electronic housings, with the difference that the template for soldering the solder balls is also used for reballing. The parameters of the resulting solder joint are close to the results of more expensive methods such as laser soldering in terms of reliability and component temperature stress. This patented method used by the HSR-01 virtually reduces the acquisition cost and operation of the equipment, achieving higher quality and more reliable pins in BGA housings. The HSR-01 features compactness and ease of operation. The station is used not only in the repair sector of consumer and other electronics, but also in testing and development.

The design and construction of the prototype soldering station HSR-01 were conceived for independent operation without the need for other apparatus, as used in other reballing methods (solder ball mounting apparatus, soldering stations, etc.). Thus, important parts have been integrated to ensure complete functionality, such as:

• Camera system with LCD display for optical alignment of the holes in the stencil with the soldering faces of the BGA housing.
• Vacuum pumps designed for fixing the housing and its subsequent dismounting.
• Controller with proportional temperature control for the soldering process.

The basic parts of the HSR-01 are described in the figure , which shows the front view, and the figure, which shows a detail of the electrode system, respectively the assembly and soldering part.

HSR-01 – Front view

1. LCD display with Raspberry Pi 3
2. Digital camera with lens
3. LED lighting
4. Electrode system cover
5. Control panel
6. Electrode system cover holder
7. Digital camera positioning locking screw
8. IR temperature sensor
9. Digital camera arm
10. LCD display and camera stand

HSR-01 – Electrode and positioning system

24.  Micrometer screw
25.  Template locking screws
26.  Template
27.  Positioning plate
28.  Positioning plate handles
29.  Electrode system holder
30.  BGA housing holder
31.  Solder ball reservoir

Main advantages

• Less power consumption, compared to available stations with the same focus on the market.
• Less heat load for the soldered BGA housing.
• Possibility of partial prediction of intermetallic layer thickness.

Protection of intellectual property

• CZ patent
• CZ utility model

Current equipment state

The device is at the prototype stage, when it is expected to sell the license and subsequently modify the design and basis for production.

Contact

Ing.

AlexandrOtáhal

Ph.D.

+420 54114 6095
xotaha00@vut.cz