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FEKT-KMTSAcad. year: 2011/2012
The subject deals with development of microelectronic passive and active components including interconnection and packaging. It´s concerned to Surface Mount Technology and Hybrid Integrated Circuits and new performances of semiconductor as MCM, CSP, Flip Chip etc.
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Planned learning activities and teaching methods
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Specification of controlled education, way of implementation and compensation for absences
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Classification of course in study plans
branch BK-MET , 3 year of study, winter semester, compulsory
branch EE-FLE , 1 year of study, winter semester, compulsory
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Laboratory exercise