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FEKT-LMOTAcad. year: 2011/2012
Organic and inorganic substrates. Technology steps in interconnection structures production. Microvia.Technology of assemled interconnection structures. Surface Mount Technology (SMT). Types of package and basic of manipulation. Solder pastes, adhesives, fluxes and their application. Pick and place components methods. Soldering processes and technology of soldering. Strategy of testing.Defects in interconnection structures and their causes.Optimization of production process
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Specification of controlled education, way of implementation and compensation for absences
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Classification of course in study plans
branch ML-MEL , 1 year of study, summer semester, elective specialisedbranch ML-EVM , 1 year of study, summer semester, compulsory
branch EE-FLE , 1 year of study, summer semester, compulsory
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