Course detail

Electronic components production

FEKT-LVSKAcad. year: 2011/2012

The basic steps for design, production and application of electronics components, integrated circuits a electronic systems is the item of this subjects. Microelectronics semiconductor components ( CMOS, BiCMOS, BIFET, etc.), hybrid circuits (thin and thick films), sensors and actuators, displeys etc. are main object. Modern assembly technologies for PC, telecomunication devices, automotive are presented and showed. SMT, MCM, CSP and Flip Chip are the main instruments in this way.

Language of instruction

Czech

Number of ECTS credits

6

Mode of study

Not applicable.

Guarantor

doc. Ing. Ivan Szendiuch, CSc.

Department

Department of Microelectronics (UMEL)

Learning outcomes of the course unit

The basic orientation in the modern electronics circuits, equipments and systems

Prerequisites

The subject knowledge on the Bachelor´s degree level is requested.

Co-requisites

Not applicable.

Planned learning activities and teaching methods

Teaching methods depend on the type of course unit as specified in the article 7 of BUT Rules for Studies and Examinations.

Assesment methods and criteria linked to learning outcomes

Design of HIC, lab noticies and lessions matter

Course curriculum

Not applicable.

Work placements

Not applicable.

Aims

To achieve basic knowledge about modern principles and methods used in design and production of electronic and electrotechnic circuits, equipments and systems regardind quality and productivity rules.

Specification of controlled education, way of implementation and compensation for absences

The content and forms of instruction in the evaluated course are specified by a regulation issued by the lecturer responsible for the course and updated for every academic year.

Recommended optional programme components

Not applicable.

Prerequisites and corequisites

Not applicable.

Basic literature

Szendiuch,I. :Mikroelektronické montážní technologie,VUTIUM VUT v Brně, 1997 (CS)

Recommended reading

Not applicable.

Classification of course in study plans

  • Programme EEKR-ML Master's

    branch ML-EVM , 2 year of study, winter semester, elective specialised
    branch ML-MEL , 2 year of study, winter semester, compulsory

  • Programme EEKR-CZV lifelong learning

    branch EE-FLE , 1 year of study, winter semester, compulsory

Type of course unit

 

Lecture

39 hod., optionally

Teacher / Lecturer

doc. Ing. Ivan Szendiuch, CSc.

Syllabus

Microelectronics and its trends, technological integration
Semiconductor components and chips
Future development in chip production, lithography
Chip assemblly - ultrasonic and termocompresion bonding
Thick and thin film technology and circuits
Hybrid Integrated Circuits
Surface Mounted Devices
SMT I - substrate and solder paste deposition
SMT II - component placement
SMT III - vawe and reflow soldering
Rework and repair in SMT
Quality and statistical process control
TQM, certifikation, CE

Laboratory exercise

26 hod., compulsory

Teacher / Lecturer

doc. Ing. Ivan Szendiuch, CSc.
Ing. Michal Řezníček, Ph.D.

Syllabus

HI´C design and HIOCAD
Screen printing and Thick Film firing
Resistors trimming and ultrasonic bonding
Testing and packaging
Assembly of Fine Pitch components
Thick film sensors