Course detail

Interconnection and assembly technolology

FEKT-NMOTAcad. year: 2011/2012

Organic and inorganic substrates. Technology steps in interconnection structures production. High density interconnection (HDI). Microvia.
Technology of assemled interconnection structures. Surface Mount Technology (SMT). Types of package and basic of manipulation. Solder pastes, adhesives, fluxes and their application. Pick and place components methods. Soldering processes and technology of soldering. Strategy of testing.
Defects in interconnection structures and their causes.
Optimization of production process

Language of instruction

English

Number of ECTS credits

6

Mode of study

Not applicable.

Guarantor

Ing. Jiří Starý, Ph.D.

Department

Department of Electrical and Electronic Technology (UETE)

Offered to foreign students

Of all faculties

Learning outcomes of the course unit

Students will be able to orientate themselves in Printed Circuit Board Production, especially In Surface Mount Technology.

Prerequisites

The subject knowledge on the Bachelor´s degree level is requested.

Co-requisites

Not applicable.

Planned learning activities and teaching methods

Teaching methods depend on the type of course unit as specified in the article 7 of BUT Rules for Studies and Examinations.

Assesment methods and criteria linked to learning outcomes

Requirements for completion of a course are specified by a regulation issued by the lecturer responsible for the course and updated for every.

Course curriculum

Not applicable.

Work placements

Not applicable.

Aims

The aim of the subject is to make students familiar with the problems of Printed Circuit Boards (PCB).
Knowlodges espec. from SMT will be on higher level. Students will have practically closer view for individul factors in each operationand their influence for production process quality

Specification of controlled education, way of implementation and compensation for absences

The content and forms of instruction in the evaluated course are specified by a regulation issued by the lecturer responsible for the course and updated for every academic year.

Recommended optional programme components

Not applicable.

Prerequisites and corequisites

Not applicable.

Basic literature

Lea, C.:A Scientific Guide to Surface Mount Technology, Electrochemical Publications Ltd, GB 1998 (EN)
Starý, J., Presentations in pdf (EN)
Wassink, R. J. K.:Manufacturing Techniques for Surface Mounted Assemblies,Electrochemical Publications Ltd, GB 1995 (EN)

Recommended reading

Hwang, J., S.:Environment-Friendly Electronics: Lead Free Technology, Electrochemical Publications Limited 2001, ISBN 0 901150 401 (EN)
Starý,J.,Šandera,J.,Kahle P.:Plošné spoje a povrchová montáž, PC DIR-REAL Brno, 1999 (CS)

Classification of course in study plans

  • Programme EECC-MN Master's

    branch MN-EVM , 1 year of study, summer semester, compulsory
    branch MN-MEL , 1 year of study, summer semester, elective specialised

Type of course unit

 

Lecture

26 hod., optionally

Teacher / Lecturer

Ing. Jiří Starý, Ph.D.

Syllabus

Organic substrates, reinforcement and resin, metal glad base material. Inorganic substrates
Organic base materials, electrical, mechanical and temperature properties. Trends in base materialsand requiremence. Inorganic base materials, their properties and comparison with organic ones.
Interconnection structures, sorting. Subtractive, semiadditive and additive methods. Trends
Technology procedures of single-layer, double layer and multi-layer PCB, Molded interconnect devices (MID). Microvia. Technology possibilities and trend.
Through Hole Technology (THT), Surface Mounted Technology (SMT) and combined THT and SMT. Technology procedures. Trend in SMT.
Solder pastes. solder alloys, adhesives, fluxes, conformal coatings and encapsulants
Application technology /screen and stencil printing, dispense/. Population of SMD, pick and place machines, principles, methods of component centering.
Surface Mounted Devices (SMD), properties and packaging, component leads, IC packages, passive components, electromechanical devices, Ball Grid Array (BGA), construction.
Soldering, methds of soldering, solder joint and solder joint reliability. Vawe soldering techniques, nitrogen atmosphere influence. Manual soldering, principles. <>Reflow soldering, methods, forced concection and nitrogen atmosphere influence. Temperature profiling. Strategy of testing. Testing of assembled and non assembled PCB. Quality control. Methods.
PCB repairs, contact and contactless methods for components disassembly and assembly. Principles and techniques for repairing. Requirements for PCB according třo IPC and Czech standards, Electrostatic Discharge (ESD)
Reliability in assembly process ond main factors.
Defects in interconnection structures and their causes.

Laboratory exercise

8 hod., optionally

Teacher / Lecturer

Ing. Jiří Starý, Ph.D.

Syllabus

Prototype production process of single - layer PCB in BUNGARD/PROTOCAD line
Prototype production process of double - layer PCB in BUNGARD/PROTOCAD line
Surface Mount Technology - printing/dispensing of solder paste/adhesive, program preparing for semiautomatic machine, pick and place with semiautomatic machine, reflow soldering, quality control
Requirements for quality of SMD placement and soldering
Contact/contactless method for assembly/disassembly SMD
Types of packages, component marking, ESD (interactive PC educational program) <>