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FEKT-BMTSAcad. year: 2012/2013
The subject deals with principles of microelectronic passive and active components including their interconnection and packaging. It´s concerned to Surface Mount Technology, Thick and Thin Film Integrated Circuits and new performances of semiconductor packaging with impact on 3D configurations, as MCM, CSP, Flip Chip, WLP etc.
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Specification of controlled education, way of implementation and compensation for absences
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branch B-MET , 3 year of study, winter semester, compulsorybranch B-EST , 3 year of study, winter semester, elective interdisciplinary
branch EE-FLE , 1 year of study, winter semester, compulsory
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