Course detail

Microelectronics and Assembly Technology

FEKT-KMTSAcad. year: 2012/2013

The subject deals with principles of microelectronic passive and active components including interconnection and packaging. It´s concerned to Surface Mount Technology, Hybrid Integrated Circuits and new performances of semiconductor packaging in 3D configuration, as MCM, CSP, Flip Chip etc.

Language of instruction

Czech

Number of ECTS credits

6

Mode of study

Not applicable.

Guarantor

doc. Ing. Ivan Szendiuch, CSc.

Department

Department of Microelectronics (UMEL)

Learning outcomes of the course unit

Basic knowledge and orientation in design and construction of electronic circuits, equipments and systems.

Prerequisites

The subject knowledge on the secondary school level is required.

Co-requisites

Not applicable.

Planned learning activities and teaching methods

Teaching methods depend on the type of course unit as specified in the article 7 of BUT Rules for Studies and Examinations.

Assesment methods and criteria linked to learning outcomes

Requirements for completion of a course are specified by a regulation issued by the lecturer responsible for the course and updated for every.

Course curriculum

Not applicable.

Work placements

Not applicable.

Aims

To dive for students knowledge about technology of microelectronics components, circuits and systems

Specification of controlled education, way of implementation and compensation for absences

The content and forms of instruction in the evaluated course are specified by a regulation issued by the lecturer responsible for the course and updated for every academic year.

Recommended optional programme components

Not applicable.

Prerequisites and corequisites

Not applicable.

Basic literature

Szendiuch, I.: Technologie elektronických obvodů a systémů. 1 vyd. Brno: Nakladatelství VUTIUM, Brno, 2007. ISBN 80-214-3292-6 (CS)

Recommended reading

Szendiuch, I.: Technologie elektronických obvodů a systémů. 1 vyd. Brno: Nakladatelství VUTIUM, Brno, 2002. ISBN 80-214-2072-3 (CS)
Szendiuch,I.: Mikroelektronické montážní technologie, VUTIUM, 1997 (CS)

Classification of course in study plans

  • Programme EECC Bc. Bachelor's

    branch BK-MET , 3 year of study, winter semester, compulsory

  • Programme EEKR-CZV lifelong learning

    branch EE-FLE , 1 year of study, winter semester, compulsory

Type of course unit

 

Lecture

39 hod., optionally

Teacher / Lecturer

doc. Ing. Ivan Szendiuch, CSc.

Syllabus

Microelectronics ant its development
Semiconductor chips - principle and their production
Basic performance of semiconductor chips and packaging
Thin and Thick Film Technology
Hybrid Integrated Circuits
SMD components for surface mount technology
Surface mount technology - technological operations
Multi Chip Modules
CSP and Flip Chip technology
Reliability of electrical joint, soldering
Quality and cerfification in electronic production
Statistic Process Control
Microelectronics and environment

Laboratory exercise

26 hod., compulsory

Teacher / Lecturer

Ing. Edita Hejátková

Syllabus

HI´C design and HIOCAD
Screen printing and Thick Film firing
Resistors trimming and ultrasonic bonding
Testing and packaging
Assembly of Fine Pitch components
Thick film sensors