Course detail

New technology for microelectronic circuits

FEKT-LMTEAcad. year: 2012/2013

Subject dealing with basic technological principles of electronic circuits, equipments and systems.
One of the basic aims of this subject is to understandingmodern electronic circuits, equipment and system design and assembly.

Language of instruction

Czech

Number of ECTS credits

6

Mode of study

Not applicable.

Guarantor

doc. Ing. Ivan Szendiuch, CSc.

Department

Department of Microelectronics (UMEL)

Learning outcomes of the course unit

The basic orientation in design and production of electronics circuits, equipments and systems

Prerequisites

The subject knowledge on the Bachelor´s degree level is requested.

Co-requisites

Not applicable.

Planned learning activities and teaching methods

Teaching methods depend on the type of course unit as specified in the article 7 of BUT Rules for Studies and Examinations.

Assesment methods and criteria linked to learning outcomes

Lab and lessions

Course curriculum

Not applicable.

Work placements

Not applicable.

Aims

To give a future engineers knowledge about new principles of design, assembly, production and maintenance of electronic circuits, equipments and systems

Specification of controlled education, way of implementation and compensation for absences

The content and forms of instruction in the evaluated course are specified by a regulation issued by the lecturer responsible for the course and updated for every academic year.

Recommended optional programme components

Not applicable.

Prerequisites and corequisites

Not applicable.

Basic literature

Szendiuch,I.: Mikroelektronické montážní technologie, VUTIUM, 1997 (kniha) ISBN 80-214-0901-0 (CS)

Recommended reading

Not applicable.

Classification of course in study plans

  • Programme EEKR-ML Master's

    branch ML-MEL , 2 year of study, summer semester, elective specialised

  • Programme EEKR-CZV lifelong learning

    branch EE-FLE , 1 year of study, summer semester, elective specialised

Type of course unit

 

Lecture

39 hod., optionally

Teacher / Lecturer

doc. Ing. Ivan Szendiuch, CSc.

Syllabus

Actual trends in microelectronics
Semiconductor chips and their assembly
Hybrid integrated circuits
Non conventional applications of TF
New trends in assembly technologies / LTCC
SMD's
MCM
Flip chip, CSP, 3D packages
SMT I - design, solder paste deposition, placement
Soldering - reflow vs. flow
SPC
TQM
Certification and ISO vs, EN, CE

Laboratory exercise

26 hod., compulsory

Teacher / Lecturer

doc. Ing. Ivan Szendiuch, CSc.

Syllabus

HI´C design and HIOCAD
Interactive design of HIC
Screen printing and Thick Film firing
Chip assembly and ultrasonic bonding
SMD practical application, testing and packaging
Repair and rework
Assembly of Fine Pitch components
Thick film sensors
Informatic system for control of production