Course detail

New technology for microelectronic circuits

FEKT-MMTEAcad. year: 2012/2013

Subject dealing with basic principles of the modern electronic technologies that are used for electronic hardware. The Impact is put on integration principles for the construction of new circuits, equipments and systems.
One of the basic aims of this subject is to understanding technology integration of modern electronic products, in the whole life cycle, including their design and assembly.
This matter is composited from managing position to give base for leadin positions. That is reason why are included also some parts about quality and environment managment.

Language of instruction

Czech

Number of ECTS credits

6

Mode of study

Not applicable.

Learning outcomes of the course unit

The student is able to take decision about basic principles in design and production of electronics circuits, equipments and systems

Prerequisites

The subject knowledge on the Bachelor´s degree level is requested.

Co-requisites

Not applicable.

Planned learning activities and teaching methods

Teaching methods depend on the type of course unit as specified in the article 7 of BUT Rules for Studies and Examinations.

Assesment methods and criteria linked to learning outcomes

Lab and lessions

Course curriculum

Not applicable.

Work placements

Not applicable.

Aims

To give a future engineers knowledge about new principles of design, assembly, production and maintenance of electronic circuits, equipments and systems

Specification of controlled education, way of implementation and compensation for absences

The content and forms of instruction in the evaluated course are specified by a regulation issued by the lecturer responsible for the course and updated for every academic year.

Recommended optional programme components

Not applicable.

Prerequisites and corequisites

Not applicable.

Basic literature

Szendiuch, I. Technologie elektronických obvodů a systémů. 1 vyd. Brno: Nakladatelství VUTIUM, Brno, 2007. ISBN 80-214-3292-6 (CS)

Recommended reading

Szendiuch,I.: Mikroelektronické montážní technologie, VUTIUM, 1997 (kniha) ISBN 80-214-0901-0 (CS)

Classification of course in study plans

  • Programme EEKR-M Master's

    branch M-MEL , 2 year of study, summer semester, elective specialised
    branch M-EST , 1 year of study, summer semester, elective interdisciplinary

  • Programme EEKR-M Master's

    branch M-MEL , 2 year of study, summer semester, elective specialised
    branch M-EST , 1 year of study, summer semester, elective interdisciplinary

  • Programme EEKR-CZV lifelong learning

    branch EE-FLE , 1 year of study, summer semester, elective specialised

Type of course unit

 

Lecture

39 hod., optionally

Teacher / Lecturer

Syllabus

Actual trends in microelectronics
Semiconductor chips and their assembly
Hybrid integrated circuits
Non conventional applications of TF
New trends in assembly technologies / LTCC
SMD's
MCM
Flip chip, CSP, 3D packages
SMT I - design, solder paste deposition, placement
Soldering - reflow vs. flow
SPC
TQM
Certification and ISO vs, EN, CE

Laboratory exercise

26 hod., compulsory

Teacher / Lecturer

Syllabus

HI´C design and HIOCAD
Interactive design of HIC
Screen printing and Thick Film firing
Chip assembly and ultrasonic bonding
SMD practical application, testing and packaging
Repair and rework
Assembly of Fine Pitch components
Thick film sensors
Informatic system for control of production