Course detail

New technology for Microelectronic Circuits

FEKT-MMTEAcad. year: 2015/2016

The subject deals with the new, modern electronics components and technologies (hardware) with the impact on understanding of microelectronic passives and actives. Interconnection and packaging with new integration solutions are objectivesduring the whole life cycle starting with design, going through production processes and finishing with liquidation. It´s concerned to Surface Mount Technology and Hybrid Integrated Circuits, which are based on thick and thin film technologies. New performances of packaging, as Multi Chip Modules,, Chip Scale Packages, Flip Chips and Low Temperature |Cofired Ceramics are described and discused including modern semiconductor chips, going to 3D packages. Regarding to recieve the complex wiev for praxis in microelectronics technology area, selected parts from quality and environmental managment are included. The subject offers also good base about electronics hardware, in the whole cycle from design , production, use, servis and liquidation. That gives for student the possibility to involve in the praxis as well to continue in PhD degree study.

Language of instruction

Czech

Number of ECTS credits

6

Mode of study

Not applicable.

Learning outcomes of the course unit

The student is able to take decision about basic principles in design and production of electronics circuits, equipments and systems

Prerequisites

The subject knowledge on the Bachelor´s degree level is requested.

Co-requisites

Not applicable.

Planned learning activities and teaching methods

Teaching methods depend on the type of course unit as specified in the article 7 of BUT Rules for Studies and Examinations.There are lessons, labs and excersizes included and also profesional text introduction. There is also e-learning (Moodle) included. Studend output is one own project.

Assesment methods and criteria linked to learning outcomes

Lab and lessions

Course curriculum

Not applicable.

Work placements

Not applicable.

Aims

To give a future engineers knowledge about new principles of design, assembly, production and maintenance of electronic circuits, equipments and systems, so that they will be able to join research, development and production subjects, and also to continue in the scientific activities.

Specification of controlled education, way of implementation and compensation for absences

The content and forms of instruction in the evaluated course are specified by a regulation issued by the lecturer responsible for the course and updated for every academic year.

Recommended optional programme components

Not applicable.

Prerequisites and corequisites

Not applicable.

Basic literature

Szendiuch, I. Technologie elektronických obvodů a systémů. 1 vyd. Brno: Nakladatelství VUTIUM, Brno, 2007. ISBN 80-214-3292-6 (CS)
Tummala, R.: Fundamentals of Microsystems Pacakaging, McGraw-Hill, New York, 2001, ISBN 0-07-137169- (EN)

Recommended reading

Szendiuch,I.: Mikroelektronické montážní technologie, VUTIUM, 1997 (kniha) ISBN 80-214-0901-0 (CS)

Classification of course in study plans

  • Programme EEKR-M Master's

    branch M-MEL , 2 year of study, summer semester, elective specialised
    branch M-EST , 1 year of study, summer semester, elective interdisciplinary

  • Programme EEKR-M Master's

    branch M-MEL , 2 year of study, summer semester, elective specialised
    branch M-EST , 1 year of study, summer semester, elective interdisciplinary

  • Programme EEKR-CZV lifelong learning

    branch EE-FLE , 1 year of study, summer semester, elective specialised

Type of course unit

 

Lecture

39 hod., optionally

Teacher / Lecturer

Syllabus

Actual trends in microelectronics
Semiconductor chips and their assembly
Hybrid integrated circuits
Non conventional applications of TF
New trends in assembly technologies / LTCC
SMD's
MCM
Flip chip, CSP, 3D packages
SMT I - design, solder paste deposition, placement
Soldering - reflow vs. flow
SPC
TQM
Certification and ISO vs, EN, CE

Laboratory exercise

26 hod., compulsory

Teacher / Lecturer

Syllabus

HI´C design and HIOCAD
Interactive design of HIC
Screen printing and Thick Film firing
Chip assembly and ultrasonic bonding
SMD practical application, testing and packaging
Repair and rework
Assembly of Fine Pitch components
Thick film sensors
Informatic system for control of production