Course detail

Design and technology of electronic instruments

FEKT-CNKPAcad. year: 2017/2018

Design and demands on electronic instruments and its manufacturing. Security of measuring instruments against unfavourable external and internal influences. The take away of heat from instrument case. Security of persons against accidents caused by electricity. Grounding and shielding. Ergonometry of measuring instruments. Technical diagnostics.

Language of instruction

English

Number of ECTS credits

5

Mode of study

Not applicable.

Guarantor

prof. Ing. Vladislav Musil, CSc.

Department

Department of Microelectronics (UMEL)

Learning outcomes of the course unit

The graduate is able to:
- describe the basic principles of an industrial property protection,
- explain the production technology preparation,
- describe the used method of electromagnetic compatibility (EMC),
- describe the used ensurings of signal distribution,
- select appropriate power source distribution on the basis of given requirements,
- name individually parazitic couplings and transfers in electronic circuits,
- explain principles of shielding,
- explain principles of thermal management,
- describe and explain individual methods of soldering,
- discuss principal possibilities of printed circuit boards,
- discuss advantages and disadvantages of surface mount technology,
- estimate respectably safety requirements for electronic equipments,
- describe the used method of diagnostics,
- discuss advantages and disadvantages of quality management methods.

Prerequisites

The subject knowledge on the secondary school level is required.

Co-requisites

Not applicable.

Planned learning activities and teaching methods

Teaching methods depend on the type of course unit as specified in the article 7 of BUT Rules for Studies and Examinations.

Assesment methods and criteria linked to learning outcomes

Practicals - 30 points; minimum 20 points.
Final exam - 70 points; minimum 30 points.

Course curriculum

1 - Industrial property protection
2 - Production technology preparation
3 - Electromagnetic compatibility (EMC)
4 - Signal distribution
5 - Power source distribution
6 - Parazitic couplings and transfers
7 - Shielding
8 - Thermal management
9 - Soldering
10 - Printed circuit boards
11 - Surface mount technology
12 - Diagnostics
13 - Safety requirements
14 - Quality management

Work placements

Not applicable.

Aims

To be introduced to practicle principles of designing electronic instruments and devices as regards both electrical and mechanical aspects - in the industrial environment.
The student acquires concrete application knowledge of electronic instrument design, which is otherwise obtained through long-term development practice. Emphasis is laid on understanding the physical essence of parasitic events so that their knowledge can be applied to other cases. He learns to foresee and anticipate the appearance of many problems arising in the development of new instruments in both the electrical and the mechanical part of the design.

Specification of controlled education, way of implementation and compensation for absences

The content and forms of instruction in the evaluated course are specified by a regulation issued by the lecturer responsible for the course and updated for every academic year.

Recommended optional programme components

Not applicable.

Prerequisites and corequisites

Not applicable.

Basic literature

Fowler, K.R.: Electronic instrument design. Oxford University Press, 1996 (EN)
Ward, T. Angus, J.: Electronic product design. Chapman and Hall, 1996 (EN)
Williams, T.: EMC for product designers, Newnes. 1996 (EN)

Recommended reading

Not applicable.

Classification of course in study plans

  • Programme EECC Bc. Bachelor's

    branch BC-MET , 3 year of study, winter semester, elective specialised

Type of course unit

 

Lecture

26 hod., optionally

Teacher / Lecturer

prof. Ing. Vladislav Musil, CSc.

Syllabus

Demands on electronic instruments and systems. Design methodology, technical documentation. Design of signal lines: symmetrical and non-symmetrical lines, properties of signal lines, execution of connections, printed circuits and their properties, optical lines.
Supply sources: mains supply, mains switches, transformers, means of interference suppression (suppression capacitors, suppression chokes, suppression elements). Supply voltage distribution: supply distribution in instrument housing and on printed circuit boards, distribution in the ground, galvanic separation of systems (impulse tranformers, optrons).
Parasitic events and their suppression: coupling in input and outtput circuits, coupling on line resistances, parasitic capacitances and inductances, transient resistances, thermoelectric voltage, overvoltage on inductive load.
Signal transmission over long lines: reflections in the lines, crosstalk, charging and discharging the lines.
Electric and magnetic field screening: electric field screening of systems and lines, magnetic field screening of systems and lines. Equipotential guarding: insulation ring guarding, teflon support point, examples of active insulation of critical points.
Selection of discrete components and application recommendation: resistors, potentiometers and potentiometric trimmers, capacotors and capacitive trimmers, inductors, diodes, transistors (bipolar, unipolar; power, HF).
Application recommendation for analog and digital integrated circuits: operational and transimpedance amplifiers, analog multiplexersand demultiplexers, comparators and timers, D/A and A/D converters, digital integrated circuits, microprocessors.
Mechanics design: regulation and control elements and their lay-out, communication and indication elements, lay-out of regulation and communication elements on the front panel of the instrument, graphic and technical aspects of the mechanical part of design, design of instrument housing.
Mechanical resistance of devices: resistance to shocks, vibration, moisture, water; abstraction of heat from the device, cooling elements, temperature stabilization (thermostatic control).
Connection of conductors and components: technology of printed circuit production, soldered.connections, wire-wrap connections, cut-in connections; technology of surface assembly.
Safety requirements: fundamental requirements, types of instrument classes, work environment, danger-to-touch protection, insulation requirements, surface paths and distances, movable liead-in wires.
Reliability of electronic instruments. Technical diagnostics and debugging of electronic instruments.
Quality management. Information in electronics, its collection and processing. Catalogues, electronic databases.

Fundamentals seminar

14 hod., optionally

Teacher / Lecturer

prof. Ing. Vladislav Musil, CSc.

Syllabus

Technical documentation
Basics of construction electronic instruments
Security of persons against accidents caused by electricity
Testing of the electronic devices
Parametrs of the electronic parts
Shielding, grounding, power and signal integrity.

Exercise in computer lab

12 hod., optionally

Teacher / Lecturer

prof. Ing. Vladislav Musil, CSc.

Syllabus

Programme LineSim a CAEME.
Programme Westbay Tools.
Basic characteristics of the CAM systems, their structure and control. Setting up the directory and paths, production of projects, relation to other modules, work in the network
Schematics module: principles of drawing schematic diagrams, levels of drawing, method of drawing schematic diagrams, checking for design correctness, content of libraries
Principles of board design, assembly technologies used, effect of parasitic events on the board, supply distribution and blocking, thermal analysis
Librarian, Package, and Layout modules: defining the geometry elements, defining the board and package, board design, autorouters, adjustment possibilities
Generating output data and processing them - the Fablink module, data export and import
Connecting the system to the respective technological facilities
Assessment of the individual project.