The subject deals with development of modern microelectronic components (hardware) with impact on passive and active components including their integration in contex with interconnection and packaging. There are described film technologies and surface mount technologies as well new performances of semiconductor as well as new modern solutions for packaging, for example multi chip moduled (MCM), chip scale packagec (CSP), Flip Chips, wafer level packaging (WLP) moving to 3D. On the base of practical use there are involved also selected parts from quality and environmental management joined to microelectronics technologies. The subject offers summary in electronics hardware, from its design to applications. That gives to students to lern and understand this matter for practical use as well for developing the knowledge in the following education process.