Course detail

Microelectronic Practice

FEKT-BMEPAcad. year: 2018/2019

The lecture which essential acquaints students with specializate laboratories in Department of Microelectronics which will be used during study in higher years. The lectures includes,

1) Methodology of printed board design (classic and SMT) with respect on assembly techiques, system EAGLE presentation and practice work with it. Simply electronic circuit design.
2) Electronic circuit realization. Realization with handle soldering by industry technical documentation. Surface mount technology is used with lead free soldering.
3) Presentation and realization of simply tasks about insert and assembly techniques in electronic ( wave soldering, reflow soldering, solder paste application with stencil, dispenser and the others), presentation of printed board production.
4) Presentation and realization of simply tasks which concern assembly techniques in microelectronic (thin and thick layer technology, chip bonding technology, packaging technology), demonstration of laser techniques.

Language of instruction

Czech

Number of ECTS credits

2

Mode of study

Not applicable.

Guarantor

doc. Ing. Josef Šandera, Ph.D.

Department

Department of Microelectronics (UMEL)

Learning outcomes of the course unit

Graduater is able:
- design simple printed board for classic and surface assemby in CAD system EAGLE
- hand solder simple circuit with chip components in package 0805 and SO
- replace chip and SO packages
- define and recognize wave soldering, reflow soldering, vapour soldering, stencil, solder paste
- define and recognize materials for printed board FR3 and FR4
- define and recognize thin and thick layer technology
- define and recognize chip assembly with bonding, with flip-chip technology

Prerequisites

The subject knowledge on the secondary school level is required.

Co-requisites

Not applicable.

Planned learning activities and teaching methods

Techning methods include information lecture, computer laboratories and practical laboratories.

Assesment methods and criteria linked to learning outcomes

Credit will be realized on the base of,

- regular visiting all parts of lectures (visiting sign teacher in paper)
- active presence in separate parts

Course curriculum

1. Classic and SMD printed board design principles
2. Practical PCB design
3. Wave soldering, reflow, vapour technology
4. Handle and semiautomat assembly technoloogy
5. Handle soldering and repairing technology
6. Assembly and revival PCB with technical documentation
7. Thin and thick layer technology
8. Chip contacting technology

Work placements

Not applicable.

Aims

The subject generally introduces with electronic and microelectronic design methodology, introduces with laboratory equipment and technology and introduce with content of special lectures, which students will attend in higher years of study.

Specification of controlled education, way of implementation and compensation for absences

All lectures are mandatory. The regular apologied lectures students could compensate after consultation with teacher in the part of lecture (during semester, in extremis in the credit week).

Recommended optional programme components

Not applicable.

Prerequisites and corequisites

Not applicable.

Basic literature

I.Szendiuch, Základy technologie mikroelektronických obvodů a systémů, VUTIUM Brno, 2006
J.Šandera, J.Starý, Mikroelektronické praktikum, elektronický text, uloženo na (CS)
J.Šandera, Návrh plošných spojů pro povrchovou montáž, Technická literatura BEN, Praha 2006
Skriptum VUT FEKT, Šandera, Starý, Bajer,Musil, Mikroelekronické praktikum II, Vydal UMEL 2003.

Recommended reading

Not applicable.

Classification of course in study plans

  • Programme EECC Bc. Bachelor's

    branch B-MET , 1 year of study, summer semester, compulsory

Type of course unit

 

Fundamentals seminar

8 hod., compulsory

Teacher / Lecturer

doc. Ing. Josef Šandera, Ph.D.
Ing. Jiří Starý, Ph.D.

Syllabus

1. Demonstration CAD system for design PCB 2. practical design classic board 3. practical design SMD board

2. Program for simulation MULTISIM

Laboratory exercise

18 hod., compulsory

Teacher / Lecturer

Ing. Jiří Starý, Ph.D.
Ing. Josef Skácel
Ing. Jan Prášek, Ph.D.
doc. Ing. Josef Šandera, Ph.D.
Ing. Alexandr Otáhal, Ph.D.

Syllabus

1) SMT technique, basic terms
2) Reflow soldering, wave soldering, dispensing, screen printing
3)Assembly of SMD
4)Printed board production
5)Repairs of printed boards