The subject gives basic overwiev about development in semiconductor chips, their production process, and also the conection on substrate. The basic steps for design, production and application of electronics components, integrated circuits a electronic systems is the item of this subjects. Microelectronics semiconductor components (CMOS, BiCMOS, BIFET, etc.), hybrid circuits (thin and thick films), sensors and actuators, displeys etc. are main object. Modern assembly technologies for PC, telecomunication devices, automotive are presented and showed. Surface Mount Technology, Multi Chip Modules, Chip Scale Packages and Flip Chips are the main instruments in this way.
The main aim is to give good overwiev abou technological processes that are used for semiconductor technologies. Theoretical part gives the impact on the understanding of physical approaches and descriebes in the simple form the principle of resistors, capacitors, diodes and transistors. Student receive the ability to join the practical approach.
The whole matter is covered through quality and reliability rules to receive the basic management ability.