Course detail

Physical Principles of the Semiconductor Technology

FSI-TP0Acad. year: 2019/2020

Individual steps in semiconductors production and device manufacturing - physics and chemistry models

Language of instruction

Czech

Number of ECTS credits

2

Mode of study

Not applicable.

Guarantor

prof. RNDr. Josef Humlíček, CSc.

Department

Institute of Physical Engineering (ÚFI)

Learning outcomes of the course unit

The course provides knowledge of processes in semiconductors production

Prerequisites

Solid State Physics, chemistry

Co-requisites

Not applicable.

Planned learning activities and teaching methods

The course is taught through lectures explaining the basic principles and theory of the discipline.

Assesment methods and criteria linked to learning outcomes

Colloquium and a brief final report on the problem solution.

Course curriculum

Not applicable.

Work placements

Not applicable.

Aims

The main purpose of the lectures given by experts from industry is to provide the students ability to:
- list and describe individual steps in semiconductors production and device manufacturing
- find how basic physics is applied in semiconductors production manufaturing
- understand how industrial processes are optimized using physics and chemistry models

Specification of controlled education, way of implementation and compensation for absences

Not applicable.

Recommended optional programme components

Not applicable.

Prerequisites and corequisites

Not applicable.

Basic literature

KERN, Werner. /Handbook of Semiconductor Wafer Cleaning Technology:Science, Technology, and Applications/. New Jersey, U.S.A.: Noyes Publications, 1993. 623 s
KITTEL, Charles. /Úvod do fyziky pevných látek : Introduction to solid state physics (Orig.)/. 1. vyd. Praha: Academia, 1985. 598 s
WOLF, Stanley a Richard N. TAUBER. /Silicon Processing for the VLSI Era/. Sunset Beach, California, U.S.A.: Lattice Press, 1999. 960 s. Vol. 1: Process Technology

Recommended reading

Not applicable.

Classification of course in study plans

  • Programme N-FIN-P Master's 1 year of study, winter semester, elective

  • Programme M2A-P Master's

    branch M-FIN , 2 year of study, winter semester, elective (voluntary)

  • Programme B3A-P Bachelor's

    branch B-FIN , 3 year of study, winter semester, elective

Type of course unit

 

Lecture

39 hod., optionally

Teacher / Lecturer

Ing. Jakub Zlámal, Ph.D.

Syllabus

The following topics will be covered:
Silicon wafer manufacturing technology overview
Silicon single crystal growth
Defects in silicon
Surface analysis in semiconductor manufacturing
Polishing and cleaning of silicon wafers
Silicon device fabrication overview
Silicon oxidation and impurity diffusion
Chemical vapor phase deposition and plasma assisted layer deposition
Photolithography, silicon oxide etching
Dry etching, metal sputtering
Applied statistics in industry