Course detail

Microelectronics and Assembly Technology

FEKT-BPC-MTSAcad. year: 2020/2021

The subject deals with development of microelectronic passive and active components including interconnection and packaging. It´s concerned to Surface Mount Technology and Hybrid Integrated Circuits and new performances of semiconductor as MCM, CSP, Flip Chip etc.

Language of instruction

Czech

Number of ECTS credits

Mode of study

Not applicable.

Guarantor

Ing. Michal Řezníček, Ph.D.

Department

Department of Microelectronics (UMEL)

Learning outcomes of the course unit

Basic knowledge and orientation in design and construction of electronic circuits, equipments and systems.

Prerequisites

The subject knowledge on the secondary school education level is requested.

Co-requisites

Not applicable.

Planned learning activities and teaching methods

Teaching methods depend on the type of course unit as specified in the article 7 of BUT Rules for Studies and Examinations.

Assesment methods and criteria linked to learning outcomes

Requirements for completion of a course are specified by a regulation issued by the lecturer responsible for the course and updated for every.

Course curriculum

Not applicable.

Work placements

Not applicable.

Aims

To dive for students knowledge about technology of microelectronics components, circuits and systems

Specification of controlled education, way of implementation and compensation for absences

The content and forms of instruction in the evaluated course are specified by a regulation issued by the lecturer responsible for the course and updated for every academic year.

Recommended optional programme components

Not applicable.

Prerequisites and corequisites

Not applicable.

Basic literature

SZENDIUCH, Ivan. Mikroelektronika a technologien součástek. Skriptum VUR vBrně, ÚMEL, ISBN 978-80-214-3960-3. (CS)
SZENDIUCH, Ivan. Základy technologie mikroelektronických obvodů a systémů. Brno: VUTIUM, 2006. ISBN 80-214-3292-6. (CS)
TUMMALA, Rao. Fundamentals of Microsystems Pacakaging. McGraw-Hill, New York, 2001, ISBN 0-07-137169-9. (EN)

Recommended reading

SZENDIUCH, Ivan. Mikroelektronické montážní technologie. VUTIUM, 1997. (CS)

Elearning

eLearning: currently opened course

Classification of course in study plans

  • Programme BPC-MET Bachelor's 3 year of study, winter semester, compulsory

Type of course unit

 

Lecture

39 hod., compulsory

Teacher / Lecturer

Ing. Josef Skácel
Ing. Martin Búran
Ing. Alexandr Otáhal, Ph.D.
Ing. Michal Řezníček, Ph.D.

Syllabus

Microelectronics ant its development
Semiconductor chips - principle and their production
Basic performance of semiconductor chips and packaging
Thin and Thick Film Technology
Hybrid Integrated Circuits
SMD components for surface mount technology
Surface mount technology - technological operations
Technology of assembly (SMT)
Reliability Statistic Process Quality and cerfification in electronic production
Microelectronics and environment

Fundamentals seminar

12 hod., optionally

Teacher / Lecturer

Ing. Michal Řezníček, Ph.D.

Laboratory exercise

26 hod., compulsory

Teacher / Lecturer

Ing. Edita Hejátková
Ing. Jakub Somer, PhD.
Ing. Alexandr Otáhal, Ph.D.
Ing. Josef Skácel
Ing. Martin Búran
Ing. Martin Adámek, Ph.D.

Syllabus

HI´C design and HIOCAD
Screen printing and Thick Film firing
Resistors trimming and ultrasonic bonding
Reflow soldering and its temperature profile, lead free solders
Basic operation in SMT, assembly process

Project

6 hod., optionally

Teacher / Lecturer

Ing. Michal Řezníček, Ph.D.

Elearning

eLearning: currently opened course