Course detail
New Technology for Microelectronic Circuits
FEKT-MPA-MTEAcad. year: 2021/2022
The subject deals with the new, modern electronics components and technologies (hardware) with the impact on understanding of microelectronic passives and actives. Interconnection and packaging with new integration solutions are objectives during the whole life cycle starting with design, going through production processes and finishing with liquidation. It´s concerned to Surface Mount Technology and Hybrid Integrated Circuits, which are based on thick and thin film technologies. New performances of packaging, as Multi Chip Modules,, Chip Scale Packages, Flip Chips and Low Temperature Cofired Ceramics are described and discused including modern semiconductor chips, going to 3D packages. Regarding to recieve the complex view for praxis in microelectronics technology area, selected parts from quality and environmental managment are included. The subject offers also good base about electronics hardware, in the whole cycle from design , production, use, servis and liquidation.
Language of instruction
Number of ECTS credits
Mode of study
Guarantor
Department
Learning outcomes of the course unit
1. Describes modern technologies used in the implementation of electronic hardware
2. Explain the basic principles of modern electronic components, from their production to applications
3. Handles theoretical and practical knowledge enabling to design and use modern components of electronic hardware, to work with their parameters
4. Designs hybrid integrated circuits and has the ability to decide on the design and construction of new circuit design
5. Is able to decide on application in design, production and service institutions in the field of microelectronics and electrical engineering, as well as acquiring prerequisites for further scientific work
Prerequisites
Co-requisites
Planned learning activities and teaching methods
Assesment methods and criteria linked to learning outcomes
HIO design: 8 pts
Written and oral exam: 80 pts
Course curriculum
1. Introduction to design and technology of electrical circuits (packaging and interconnection)
2. Thick-film technology I - (materials)
3. Thick film technology II - (processes)
4. Vacuum technologies and mass operations on chips
5. Assembly and interconnection of semiconductor chips, packaging
6. ESD - Electrostatic discharge
7. Modern electronic packages QFN and BGA
8. Legislation, EcoDesign and human health
9. Quality and reliability in electrical engineering
10. Practical view to repairs of electronic assemblies
Work placements
Aims
Specification of controlled education, way of implementation and compensation for absences
1. Hybrid integrated circuit design
2. Realization of hybrid integrated circuit
3. Packaging and interconnection of microelectronic structures
4. Soldering of complex electronic packages
5. Production of LTCC structures
Recommended optional programme components
Prerequisites and corequisites
Basic literature
Li, Y., Goyal, D.: 3D Microelectronic Packaging: From Fundamentals to Applications, Springer; 1st edition, 2017, ISBN: 978-3-319-44586-1 (EN)
Tummala, R.: Fundamentals of Device and Systems Packaging: Technologies and Applications, McGraw-Hill Education; 2 edition, 2019, ISBN: 978-1259861550 (EN)
Recommended reading
Classification of course in study plans