Course detail

Microelectronic technologies

FEKT-DPC-ME2Acad. year: 2021/2022

The subject is focused on a study of the microelectronic technologies using seminary and self-study. Students will take-up overview about elemental and advanced methods and techniques, material utilization, and rules for microstructure creation. They will know how to take bearings in areas of the design and fabrication, as well about utilization of nanotechnologies in microelectronics.

Language of instruction

Czech

Number of ECTS credits

4

Mode of study

Not applicable.

Guarantor

prof. Ing. Jaromír Hubálek, Ph.D.

Department

Department of Microelectronics (UMEL)

Learning outcomes of the course unit

Preview of the mehods and techniques in thin-film and semicoductor technology, design skill of the microstructures and nanostructures using advanced techniques of fabrication.

Prerequisites

no

Co-requisites

Not applicable.

Planned learning activities and teaching methods

Teaching methods depend on the type of course unit as specified in the article 7 of BUT Rules for Studies and Examinations.

Assesment methods and criteria linked to learning outcomes

Evaluation of oral exam according to prepared presentation, understanding, ability to present topic and references studied.

Course curriculum

1. Elemental methods for the thin-film deposition,
2. Materials in the thin-film technology,
3. Topology design, lithography,
4. Anisotropic and isotropic etching of the microstructures,
5. The thermal and chemical oxidation,
6. Anodization,
7. Impurity diffusion,
8. Passive layers,
9. Modern methods of the microstructure creation,
10. MEMS,
11. Nanotechnology
12. Nanoelectronics,
13. NEMS.

Work placements

Not applicable.

Aims

Student is going to familiarize with the elemental and advanced methods and techniques for the microstructures and semiconductor devices fabrication, with materials, rules for their creation and modern nanotechnologies in semiconductor industry.

Specification of controlled education, way of implementation and compensation for absences

Not applicable.

Recommended optional programme components

Not applicable.

Prerequisites and corequisites

Not applicable.

Basic literature

MEMS and Nanotechnology Clearinghouse, http://www.memsnet.org (EN)
TJ. Coutts, Active and Passive Thin Film Device. Academic Press, London 1978, pp.1-858 (EN)

Recommended reading

Courtesy Sandia National Laboratories, SUMMiTTM Technologies, www.mems.sandia.gov (EN)
C.T. Leondes, MEMS/NEMS Handbook: Techniques and Applications, Vol. 1-5. Springer Science, 2006 (EN)
H.O. Pierson, Handbook of Chemical Vapor Deposition. William Andrew Publishing, LLC Norwish, NY, USA, 1999, ISBN 0-8155-1432-8 (EN)
H.S. Nalez, Handbook of Organic-Inorganic Hybrid Materials and Nanocoposities, Vol. 1-2, American Scientific Publisher, 2003. (EN)
M.A. Reed and T. Lee, Molecular Nanoelectronics. American Scientific Publisher, 2003, ISBN 1-58883-006-3 (EN)
Michael Kraft: Micromachined Inertial Sensors Recent Developments at BSAC, prezentace, Berkeley Sensor &Actuator Center, California,USA (EN)
S. Sivaram, Chemical Vapor Deposition. International Thomson Publishing Inc., 1995, ISBN 0-442-01079-6 (EN)

Classification of course in study plans

  • Programme DPC-EKT Doctoral 0 year of study, summer semester, compulsory-optional
  • Programme DPC-KAM Doctoral 0 year of study, summer semester, compulsory-optional
  • Programme DPC-MET Doctoral 0 year of study, summer semester, compulsory-optional
  • Programme DPC-SEE Doctoral 0 year of study, summer semester, compulsory-optional
  • Programme DPC-TEE Doctoral 0 year of study, summer semester, compulsory-optional
  • Programme DPC-TLI Doctoral 0 year of study, summer semester, compulsory-optional

Type of course unit

 

Seminar

39 hod., optionally

Teacher / Lecturer

prof. Ing. Jaromír Hubálek, Ph.D.