Course detail
Microelectronics and Assembly Technology
FEKT-BPC-MTSAcad. year: 2022/2023
The subject deals with the new, modern electronics components and technologies (hardware) with the impact on understanding of microelectronic passives and actives. Interconnection and packaging with new integration solutions are objectivesduring the whole life cycle starting with design, going through production processes and finishing with liquidation. It´s concerned to Surface Mount Technology and Hybrid Integrated Circuits, which are based on thick and thin film technologies. New performances of packaging, as Multi Chip Modules,, Chip Scale Packages, Flip Chips and Wafer Level Packages etc. are described and discused including modern semiconductor chips, going to 3D packages. Regarding to recieve the complex wiev for praxis in microelectronics technology area, selected parts from quality and environmental managment are included. The subject offers also good base about electronics hardware, in the whole cycle from design , production, use, servis and liquidation. That gives for student the possibility to involve in the praxis as well to continue in master degree study.
Language of instruction
Number of ECTS credits
Mode of study
Guarantor
Department
Learning outcomes of the course unit
Student after passing the subject:
1. Enables the basic issues of electronic hardware, its importance, its composition and its basic use
2. Understand and explain the basic nature of individual electronic components and describe their principles of implementation and use
3. Explains the theoretical function of basic hardware components and identifies its most commonly used types, names their parameters in relation to use in various applications
4. Is able to design hybrid integrated circuits, demonstrate and clarify the basic principles of their implementation and execution
5. Undertakes or supports an opinion on its own application in manufacturing, service and design institutions in the field of microelectronics and electrotechnics, and also develops basic prerequisites for master's studies
Prerequisites
Co-requisites
Planned learning activities and teaching methods
Assesment methods and criteria linked to learning outcomes
Course curriculum
2. Thick film technology.
3. Semiconductor chips and integrated circuits.
4. Passive components.
5. Interconnection in microelectronics.
6. Packaging and thermal management of integrated circuits.
7. Assembly and surface mount technology.
8. Soldering profiles setting depending on the chosen soldering method.
9. Quality managementin electronic production and legislation.
10. Ecodesign and human health, ecological design of electrotechnical products.
Work placements
Aims
Specification of controlled education, way of implementation and compensation for absences
Lab exercise :
1. Design of a hybrid integrated circuit.
2. Practical realization of hybrid integrated circuit.
3. Measurement of thick film resistors by four-wire method.
4. Trimming od thick film resistors and their statistical evaluation.
5. Soldering and measuring of temperature profiles.
6. Packaging and interconnection.
Recommended optional programme components
Prerequisites and corequisites
Basic literature
SZENDIUCH, Ivan. Mikroelektronika a technologien součástek. Skriptum VUR vBrně, ÚMEL, ISBN 978-80-214-3960-3. (CS)
SZENDIUCH, Ivan. Základy technologie mikroelektronických obvodů a systémů. Brno: VUTIUM, 2006. ISBN 80-214-3292-6. (CS)
TUMMALA, Rao. Fundamentals of Microsystems Pacakaging. McGraw-Hill, New York, 2001, ISBN 0-07-137169-9. (EN)
Recommended reading
Elearning
Classification of course in study plans
- Programme BPC-MET Bachelor's 3 year of study, winter semester, compulsory
Type of course unit
Lecture
Teacher / Lecturer
Syllabus
Semiconductor chips - principle and their production
Basic performance of semiconductor chips and packaging
Thin and Thick Film Technology
Hybrid Integrated Circuits
SMD components for surface mount technology
Surface mount technology - technological operations
Technology of assembly (SMT)
Reliability Statistic Process Quality and cerfification in electronic production
Microelectronics and environment
Fundamentals seminar
Teacher / Lecturer
Laboratory exercise
Teacher / Lecturer
Syllabus
Screen printing and Thick Film firing
Resistors trimming and ultrasonic bonding
Reflow soldering and its temperature profile, lead free solders
Basic operation in SMT, assembly process
Elearning