Course detail
Selected diagnostic methods, reliability and quality
FEKT-DKC-ET2Acad. year: 2022/2023
Investigations of electrochemical power sources and related systems, potentiostat measurements. Methods for evaluation of activity and lifetime of electrode materials designed for electrochemical power sources.
Methods of scanning electron microscopy, interaction of electrons with solids, signals and their exploitation in diagnostics. Environmental scanning electron microscopy, study of non-conductive materials, phenomena on phase interfaces, dynamical in-situ experiments.
Electron spectroscopy, survey of electron spectroscopy methods. X-ray spectroscopy, energy and wave length dispersive methods.
Methods of X-ray diffractography, powder diffraction spectroscopy. Special diagnostics methods.
Defects of printed circuit boards, influence of material and process factors on their formation. Microscopic methods for defects diagnostics in printed circuit boards.
Reliability and quality, methods of reliability analysis. Quality control processes. Methods and procedures for risk assessment, risk management.
Language of instruction
Number of ECTS credits
Mode of study
Guarantor
Learning outcomes of the course unit
Prerequisites
Co-requisites
Planned learning activities and teaching methods
Assesment methods and criteria linked to learning outcomes
Course curriculum
8. Methods of scanning electron microscopy, interaction of electrons with solids, interaction volume, signals and their exploitation in diagnostics.
9. Electron spectroscopy, overview and principles of electron spectroscopy methods. X-ray spectroscopy, energy and wave length dispersive methods.
10. Environmental scanning electron microscopy, study of non-conductive materials, investigation of phenomena on phase interfaces. Study of materials during dynamical in-situ experiments.
11. Methods of X-ray diffractography, powder diffraction spectroscopy. Special diagnostics methods.
12. Defects in soldered printed circuit boards, influence of material and process factors on their formation. Microscopic methods and techniques for defects diagnosis in printed circuit boards.
13. Reliability and quality, methods of reliability analysis. Quality control processes. Methods and procedures for risk assessment, risk management.
Work placements
Aims
Specification of controlled education, way of implementation and compensation for absences
Recommended optional programme components
Prerequisites and corequisites
Basic literature
Brett,C.M.A.,Brett,A.M.O.: Electrochemistry, Oxford, 1993. (EN)
Connor,D.J., Sexton,B.A., Smart,R.C.: Surface Analysis Methods in Materials Science, 2003. (EN)
Eckertová,L., Frank,L.: Elektronová mikroskopie a difrakce, Academia, Praha,1996. (CS)
Frank,L., Král,J.: Metody analýzy povrchů, Academia, Praha, 2002. (CS)
Kececioglu,D.: Maintainability, Availability and Operational Readiness Engineering Handbook, Vol.1. Prentice Hall, Englewood Cliffs, New Jersey, 1995. (EN)
Reimer,L.: Scanning electron microscopy, Springer Verlag Berlin,1999. (EN)
Van Zant,P.:Microchip Fabrication. McGraw-Hill New York, 2000. (EN)
Recommended reading
Classification of course in study plans
- Programme DKC-EKT Doctoral 0 year of study, summer semester, compulsory-optional
- Programme DKC-KAM Doctoral 0 year of study, summer semester, compulsory-optional
- Programme DKC-MET Doctoral 0 year of study, summer semester, compulsory-optional
- Programme DKC-SEE Doctoral 0 year of study, summer semester, compulsory-optional
- Programme DKC-TEE Doctoral 0 year of study, summer semester, compulsory-optional
- Programme DKC-TLI Doctoral 0 year of study, summer semester, compulsory-optional