Course detail

Physical Principles of the Semiconductor Technology

FSI-TP0Acad. year: 2023/2024

Individual steps in semiconductors production and device manufacturing - physics and chemistry models

Language of instruction

Czech

Number of ECTS credits

2

Mode of study

Not applicable.

Guarantor

prof. RNDr. Josef Humlíček, CSc.

Department

Institute of Physical Engineering (ÚFI)

Entry knowledge

Solid State Physics, chemistry

Rules for evaluation and completion of the course

Colloquium and a brief final report on the problem solution.

Aims

The main purpose of the lectures given by experts from industry is to provide the students ability to:
- list and describe individual steps in semiconductors production and device manufacturing
- find how basic physics is applied in semiconductors production manufaturing
- understand how industrial processes are optimized using physics and chemistry models
The course provides knowledge of processes in semiconductors production

Study aids

Not applicable.

Prerequisites and corequisites

Not applicable.

Basic literature

KERN, Werner. /Handbook of Semiconductor Wafer Cleaning Technology:Science, Technology, and Applications/. New Jersey, U.S.A.: Noyes Publications, 1993. 623 s
KITTEL, Charles. /Úvod do fyziky pevných látek : Introduction to solid state physics (Orig.)/. 1. vyd. Praha: Academia, 1985. 598 s
WOLF, Stanley a Richard N. TAUBER. /Silicon Processing for the VLSI Era/. Sunset Beach, California, U.S.A.: Lattice Press, 1999. 960 s. Vol. 1: Process Technology

Recommended reading

Not applicable.

Classification of course in study plans

  • Programme B-FIN-P Bachelor's 3 year of study, winter semester, elective
  • Programme N-FIN-P Master's 1 year of study, winter semester, elective
    2 year of study, winter semester, elective

Type of course unit

 

Lecture

39 hod., optionally

Teacher / Lecturer

RNDr. Petr Pánek, PhD.

Syllabus

The following topics will be covered:
Silicon wafer manufacturing technology overview
Silicon single crystal growth
Defects in silicon
Surface analysis in semiconductor manufacturing
Polishing and cleaning of silicon wafers
Silicon device fabrication overview
Silicon oxidation and impurity diffusion
Chemical vapor phase deposition and plasma assisted layer deposition
Photolithography, silicon oxide etching
Dry etching, metal sputtering
Applied statistics in industry