Course detail

Design and Technology of Electronic Equipments

FEKT-MPA-KTEAcad. year: 2023/2024

Demands on electronic instruments and systems. Design and consruction of electronic instruments and its manufacturing. Electromagnetic compatibility. Design on electrical level, components selection, application rules, schematic capture, parasitic couplings and transfers, practical rules. Reliability of electronic instruments. Technical diagnostics. Security of electronic instruments against unfavourable external and internal influences. Thermal management. Security of persons against accidents caused by electricity. Grounding and shielding. Ergonometry of measuring instruments.

Language of instruction

English

Number of ECTS credits

5

Mode of study

Not applicable.

Guarantor

doc. Ing. Pavel Šteffan, Ph.D.

Department

Department of Microelectronics (UMEL)

Entry knowledge

The subject knowledge on the Bachelor´s degree level is requested.

Rules for evaluation and completion of the course

Practicals - 30 points; minimum 20 points.
Final exam - 70 points; minimum 30 points.
The content and forms of instruction in the evaluated course are specified by a regulation issued by the lecturer responsible for the course and updated for every academic year.

Aims

To be introduced to practicle principles of designing electronic instruments and devices as regards both electrical and mechanical aspects - in the industrial environment.
Design and properties of signal lines, supply lines and distribution frames - suppression of interference and ground loops. Parasitic events and their suppression - coupling in input and output circuits, parasitic capacitances and inductances, thermoelectric voltage, overvoltage on inductive load, reflections on lines, crosstalk.Electric and magnetic field screening, equipotential guarding. Choice of components and application recommendation - discrete elements, operational amplifiers, comparators, electronic switches, A/D and D/A converters, sample-and-hold elements, digital circuits, microprocessors. Mechanics design: regulation, control and indication elements - lay-ou on the front panel, instrument housing design, heat removal, thermostatic elements. Printed circuits, wired printed circuits, connection of conductors and components. Safety requirements in instrument design. The student acquires concrete application knowledge of electronic instrument design, which is otherwise obtained through long-term development practice. Emphasis is laid on understanding the physical essence of parasitic events so that their knowledge can be applied to other cases. He learns to foresee and anticipate the appearance of many problems arising in the development of new instruments in both the electrical and the mechanical part of the design.
The graduate is able to:
- describe the basic principles of an industrial property protection,
- explain the production technology preparation,
- describe the used method of electromagnetic compatibility (EMC),
- describe the used ensurings of signal distribution,
- select appropriate power source distribution on the basis of given requirements,
- name individually parazitic couplings and transfers in electronic circuits,
- explain principles of shielding,
- explain principles of thermal management,
- describe and explain individual methods of soldering,
- discuss principal possibilities of printed circuit boards,
- discuss advantages and disadvantages of surface mount technology,
- estimate respectably safety requirements for electronic equipments,
- describe the used method of diagnostics,
- discuss advantages and disadvantages of quality management methods.

Study aids

Not applicable.

Prerequisites and corequisites

Not applicable.

Basic literature

Fowler, K., R.: Electronic instrument design, Oxford University Press, 1996, ISBN: 978-0195685657 (EN)
Maxfield, C., Bird, J.: Electrical Engineering: Know It All (Newnes Know It All), Newnes, 2008, ISBN: 978-1856175289 (EN)
Ward,T., Angus, J.: Electronic product design, Chapman and Hall, 1996, ISBN: 978-0748751709 (EN)
Williams, T.: EMC for Product Designers Paperback, Newnes, 2016, ISBN: 978-0081010167 (EN)
Wilson, T., G.: Power Electronics: Principles of Analysis and Design with Emphasis on Magnetics Volume 1, 2019, ISBN: 978-1543140613 (EN)

Recommended reading

Not applicable.

Classification of course in study plans

  • Programme MPAD-MEL Master's 2 year of study, winter semester, compulsory-optional
  • Programme MPAD-CAN Master's 0 year of study, winter semester, elective
  • Programme MPA-MEL Master's 2 year of study, winter semester, compulsory-optional
  • Programme MPAD-CAN Master's 0 year of study, winter semester, elective
  • Programme MPA-AEE Master's 0 year of study, winter semester, elective

Type of course unit

 

Lecture

26 hod., optionally

Teacher / Lecturer

doc. Ing. Pavel Šteffan, Ph.D.

Syllabus

Problems and its complex analysis. Theory of systems, system approach, system analysis and synthesis. Development of a new product, its phases: design and preparation of production. Electronic components.
Theory of modelling, errors in modelling. Theory of measurement. Technical experiment in the system meaning. Analysis of the process of technical objects development. Methodology TRIZ etc.
Computer-aided design of printed boards: schematic capture design, design of a printed-board art-work.
Production technology of printed boards.
Surface mount techology: devices for SMT, soldering of SMD.
Properties of printed boards: resistence, skin effect, capacitanc, inductance, impedance, velocity of signal propagation,
Electromagnetic compatibility: basic terms and definitions, law systém in the Czech Republic (law No 22/1997 Sb. and Government Directive No 169/1997 Sb., EMC standards - susceptibility and radiation), electromagnetic compatibility and design of printed boards (disturbances, electromagnetic field of a current loop, electromagnetic field of a straight conductor, frequency spectrum of a trapezoid pulse, common-mode and different-mode disturbances, PCB design from the view of EMC, devices and EMC).
Design rules: device placement, layer stackup of PCB, grounding (one-point and multi-point grounding, bypassing), real capacitor, PCB layers as a capacitor, design of a local and common capacitor, design of filtering capacitors, bypassing and decoupling capacitors placement.
Design rules: supply sources (analogue and switched sources), digital circuits (schematic design rules, device placement and track routing rules), clock circuits (trace separation and termination, reflections and their minimalisation), analogue circuits, A/D converters, power switching circuits, I/O circuits (isolation and partioning, filtering and grounding of inputs and outputs, galvanic bypassing and decoupling), ESD protection (protection of I/O terminals, PCB protection). Computer-aided methods for checking and support of PCB design.
Mechanical design (enclosure design, ergonomics, PCB design and cabling, thermal management). Interparts connection, EMC. Human interface (interface design specifications).
Basic production opetations. Mounting sequency. Quality of elektronic equipments, TQM, FMEA. Evaluation, certification and file agreement. The law about the technical requiremenets on products.
Technical dokumentation preparation. Reengineering. Concurrent engineering. Intellectual property and its protection. Safety regulation. Design for production, . Production preparation, prototyping and manufacturing.
Technical diagnostics and debugging of electronic

Exercise in computer lab

26 hod., compulsory

Teacher / Lecturer

doc. Ing. Pavel Šteffan, Ph.D.

Syllabus

Programme LineSim a CAEME.
Programme Westbay Tools.
Basic characteristics of the CAM systems, their structure and control. Setting up the directory and paths, production of projects, relation to other modules, work in the network.
Schematics module: principles of drawing schematic diagrams, levels of drawing, method of drawing schematic diagrams, checking for design correctness, content of libraries.
Principles of board design, assembly technologies used, effect of parasitic events on the board, supply distribution and blocking, thermal analysis.
Librarian, Package, and Layout modules: defining the geometry elements, defining the board and package, board design, autorouters, adjustment possibilities.
Generating output data and processing them - the Fablink module, data export and import.
Connecting the system to the respective technological facilities.
Assessment of the individual project.