The subject deals with the new, modern electronics components and technologies (hardware) with the impact on understanding of microelectronic passives and actives. Interconnection and packaging with new integration solutions are objectives during the whole life cycle starting with design, going through production processes and finishing with liquidation. It´s concerned to Surface Mount Technology and Hybrid Integrated Circuits, which are based on thick and thin film technologies. New performances of packaging, as Multi Chip Modules,, Chip Scale Packages, Flip Chips and Low Temperature Cofired Ceramics are described and discused including modern semiconductor chips, going to 3D packages. Regarding to recieve the complex view for praxis in microelectronics technology area, selected parts from quality and environmental managment are included. The subject offers also good base about electronics hardware, in the whole cycle from design , production, use, servis and liquidation.