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FEKT-MKC-MOTAcad. year: 2023/2024
Subject deals with nterconnection technology and assembly techniques with following topics.Interconnection technology, methods, properties. Levels of interconnection. Organic and inorganic substrates. Technology steps in interconnection structures production. High density interconnection (HDI). Microvia.Technology of assembled interconnection structures. Surface Mount Technology (SMT). Types of package and basic of manipulation. Solder pastes, adhesives, fluxes and their application. Adhesives and technology of adhesive joint. Soldering processes and technology of soldering and cleaning. Strategy of testing. Defects in interconnection structures and their causes.Optimization of production process.
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