Course detail

Interconnection and Assembly Technology

FEKT-MKC-MOTAcad. year: 2023/2024

Subject deals with nterconnection technology and assembly techniques with following topics.
Interconnection technology, methods, properties. Levels of interconnection. Organic and inorganic substrates. Technology steps in interconnection structures production. High density interconnection (HDI). Microvia.
Technology of assembled interconnection structures. Surface Mount Technology (SMT). Types of package and basic of manipulation. Solder pastes, adhesives, fluxes and their application. Adhesives and technology of adhesive joint. Soldering processes and technology of soldering and cleaning. Strategy of testing. Defects in interconnection structures and their causes.
Optimization of production process.

Language of instruction

Czech

Number of ECTS credits

5

Mode of study

Not applicable.

Guarantor

Ing. Jiří Starý, Ph.D.

Department

Department of Electrical and Electronic Technology (UETE)

Entry knowledge

The subject knowledge on the Bachelor´s degree level is requested.

Rules for evaluation and completion of the course

Evaluation of laboratory works - max 15 points, test - max 25 points, final written examination - max 50 points, oral final examination - max 10 points. Written and oral part of final examination are duty. Progress to oral part of final examination is only after receiving min 25 points from written part of final examination. Oral part of final examination is passed with min 4 points.
Examination is oriented to evaluation of received knowledges from interconnection and assembly technology topics and in practical orientation technology analysis of real assembled PCB. Student in this analysis demonstrates ability to choose conforming technology procedure of components assembly and of PCB realisation (step by step) including guestions of applied material.
Requirements for completion of a course are specified by a regulation issued by the lecturer responsible for the course and updated for every year.
The content and forms of instruction in the evaluated course are specified by a regulation issued by the lecturer responsible for the course and updated for every academic year.

Aims

The aim of the subject is to make students familiar with the problems of Printed Circuit Boards (PCBs). Knowlodges espec. from SMT, solder and adhesive joint realisation will be on higher level. Students will have practically closer view for individul factors in each operation and their influence for production process quality.
Students will be able to:
 define basic principles from assembly and inteconnection techniques, explain levels of interconnection
 describe sorts and explain methods of assembled joint realisation. Describe and explain factors influencing quality of assembled joint
 explain technology procedure of multilayer PCB with microvia. Describe and explain individual production step
 explain mechanism of adhesion joint, properties and types of physically hardened and chemically cured adhesives
 explain mechanism of solder joint, solder joint requirements, soldering techniques, diferences between tin/lead and lead free solder joint. Explain chemistry and cleaning techniques of PCBś and assembled PCBś
 technology analysis of PCB - student is able to choose compatible technology process of PCB realisation, process of components assembly and PCB material

Study aids

Not applicable.

Prerequisites and corequisites

Not applicable.

Basic literature

Lea, C.:A Scientific Guide to Surface Mount Technology, Electrochemical Publications Ltd, GB 1998 (EN)
Normy ANSI/IPC-A-610 rev. E,The Institute for Electronic and Packaging Electronic Circuits, USA, ANSI/IPC-CM-770C a ANSI/IPC-SM-782 a normy ČSN EN dle doporučení (CS)
Starý, J., Zatloukal, M.: MMOT - Montážní a propojovací technologie, skripta verze 1.1., 2014 (CS)
Starý,J.,Šandera,J.,Kahle P.:Plošné spoje a povrchová montáž, PC DIR-REAL Brno, 1999 (CS)
Wassink, R. J. K.:Manufacturing Techniques for Surface Mounted Assemblies,Electrochemical Publications Ltd, GB 1995 (EN)

Recommended reading

Hwang, J., S.:Environment-Friendly Electronics: Lead Free Technology, Electrochemical Publications Limited 2001, ISBN 0 901150 401 (EN)

Classification of course in study plans

  • Programme MPC-EVM Master's 1 year of study, winter semester, compulsory

Type of course unit

 

Lecture

26 hod., optionally

Teacher / Lecturer

Ing. Jiří Starý, Ph.D.

Syllabus

Organic substrates, reinforcement and resin, metal glad base material. Inorganic substrates
Organic base materials, electrical, mechanical and temperature properties. Trends in base materialsand requiremence. Inorganic base materials, their properties and comparison with organic ones.
Interconnection structures, sorting. Subtractive, semiadditive and additive methods. Trends
Technology procedures of single-layer, double layer and multi-layer PCB, Molded interconnect devices (MID). Microvia. Technology possibilities and trend.
Through Hole Technology (THT), Surface Mounted Technology (SMT) and combined THT and SMT. Technology procedures. Trend in SMT.
Solder pastes. solder alloys, adhesives, fluxes, conformal coatings and encapsulants
Application technology /screen and stencil printing, dispense/. Population of SMD, pick and place machines, principles, methods of component centering.
Surface Mounted Devices (SMD), properties and packaging, component leads, IC packages, passive components, electromechanical devices, Ball Grid Array (BGA), construction.
Soldering, methds of soldering, solder joint and solder joint reliability. Vawe soldering techniques, nitrogen atmosphere influence. Manual soldering, principles. <>Reflow soldering, methods, forced concection and nitrogen atmosphere influence. Temperature profiling. Strategy of testing. Testing of assembled and non assembled PCB. Quality control. Methods.
PCB repairs, contact and contactless methods for components disassembly and assembly. Principles and techniques for repairing. Requirements for PCB according třo IPC and Czech standards, Electrostatic Discharge (ESD)
Reliability in assembly process ond main factors.
Defects in interconnection structures and their causes.

Laboratory exercise

8 hod., compulsory

Teacher / Lecturer

Ing. Jiří Starý, Ph.D.

Syllabus

Prototype PCB production process - BUNGARD/PROTOCAD line
Laboratory No1:
o base materials, PCB production 2 layers PCB, multilayer PCB, HDI, PCB assemby
o chemistry. PCB cleaning. Ionic contamination measurement.
Laboratory No2: Thermal capacity of SMD and influence on temperature profile
o temperature profile during reflow soldering in in-line reflow oven
o temperature response of stacked structures FR4/FR4, Al2O3/FR4
o workstation PACE TF 2700 - deassy and assy of SMD.
Laboratory No3: Wetting balance test method and wettability tests od THT/SMD leads. Surface treatment influence. Preparing microsection - part1.
Laboratory No4: Preparing microsection - part2., microsection evaluation with stereomicroscope. Defects of PCB and causes.