Course detail

Microelectronic Practice

FEKT-BPC-MEPAcad. year: 2024/2025

The lecture which essential acquaints students with specializate laboratories in Department of Microelectronics which will be used during study in higher years. The lectures includes:
1) Methodology of printed board design (classic and SMT) with respect on assembly techiques, system EAGLE presentation and practice work with it. Simply electronic circuit design.
2) Electronic circuit realization. Realization with handle soldering by industry technical documentation. Surface mount technology is used with lead free soldering.
3) Revival of circuit ( sig. generator, oscillograph, multimetr).
4) Presentation and realization of simply tasks which concern assembly techniques in microelectronic (thin and thick layer technology, chip bonding technology, packaging technology), demonstration of laser techniques.

Language of instruction

Czech

Number of ECTS credits

2

Mode of study

Not applicable.

Entry knowledge

The subject knowledge on the secondary school level are required.

Rules for evaluation and completion of the course

Credit will be realized on the base of regular visiting all parts of lectures (visiting sign teacher in paper)


All excercise are mandatory. The regular apologied excercises students could compensate after consultation with teacher in the part of lecture (during semester, in extremis in the credit week).

Aims

The subject generally introduces with electronic and microelectronic design methodology, introduces with laboratory equipment and technology and introduce with content of special lectures, which students will attend in higher years of study.
Graduater is able:
- design simple printed board for classic and surface assemby in CAD system EAGLE
- hand solder simple circuit with chip components in packages 1206, 0805 and SO
- realize basic measure with generetor, ocsillograph, multimetr
- replace chip package 0805, 1206 and SO packages
- define and recognize materials for printed board FR3 and FR4
- define and recognize thin and thick layer technology
- define and recognize chip assembly with bonding, with flip-chip technology

Study aids

Not applicable.

Prerequisites and corequisites

Not applicable.

Basic literature

SZENDIUCH, Ivan. Základy technologie mikroelektronických obvodů a systémů. Brno: VUTIUM, 2006. ISBN 80-214-3292-6.
ŠADNERA, Josef. Návrh plošných spojů pro povrchovou montáž. Technická literatura BEN, Praha 2006.
ŠANDERA, Josef, STARÝ, Jiří. Mikroelektronické praktikum. elektronický výukový text. (CS)

Recommended reading

Not applicable.

Elearning

Classification of course in study plans

  • Programme BPC-AMT Bachelor's 0 year of study, winter semester, elective

  • Programme BPC-AUD Bachelor's

    specialization AUDB-TECH , 3 year of study, winter semester, compulsory-optional
    specialization AUDB-ZVUK , 3 year of study, winter semester, compulsory-optional

  • Programme BPC-ECT Bachelor's 0 year of study, winter semester, elective
  • Programme BPC-MET Bachelor's 2 year of study, winter semester, compulsory
  • Programme BPC-SEE Bachelor's 0 year of study, winter semester, elective
  • Programme BPC-TLI Bachelor's 3 year of study, winter semester, compulsory-optional

Type of course unit

 

Laboratory exercise

26 hod., compulsory

Teacher / Lecturer

Syllabus

Návrh desek plošných spojů.

Kontrukce a oživování detektoru vodní hladiny.

Kontrkukce mikroelektronických struktur.

Ukázka zařízení pro mikroelektronické technologie, pouzdření a pájení přetavením.

Elearning