Course detail

Microelectronic Practice 2

FEKT-BPC-MP2Acad. year: 2024/2025

Philosopy of construction electronic and microelectronic equipment, right methos of design, modern electrical and mechanical parts for construction, modern construct materials (plastics, composites, metals), their electrical and mechanical properties, their distinguish and right use. Theoretical use and design of printed boards, thin and thick layers, legislation for production introduce.
Practical skills for soldering. Design for cheap and succesfful production (DFM).

Language of instruction

Czech

Number of ECTS credits

5

Mode of study

Not applicable.

Entry knowledge

The subject knowledge on the secondary school level is required.

Rules for evaluation and completion of the course

Credit will be realized on the base of,
- regular and active visiting all parts of exercises
- realization mandatory projects (equipments)
Excused excercise could be compensate.

The exam will be written and oral.

Conditions for succesfully finishing of course determines notice which publish garant of lectures.

Aims

The main task of course is to prepare students theoretically and main practically for electrotechnical work an design. The lectures refill other lectures in branch. The students will be theoretically and practically inform about electrical and mechanical design rules and printed board design. Special differencies for medicine, automotive, military, consumer and other technique will be presented. It will present problems with construction of test template for resuscitation and programming. It will be also presented questions with ecology and safety. During lectures receive students practical skills about soldering. English terminology will be presented.
Student receives theoretical bases about right design electronic and microelectronic equipment. Theoretical knowledge uses for electronic and mechanic design and realization own electronic equipment. Student will have overview about using technologies, and particully receives informations, how succesffuly realized research an electronic production. He will be able to solder classic and surface mount components, and will be able design printed board. Student will be able practically design and realized thick layer circuit.

Study aids

Not applicable.

Prerequisites and corequisites

Not applicable.

Basic literature

R.S.VILLANUCI , A.W. AVTGIS, W.F. MEGOW. Electronic Techniques (fifth edition). Prentice - Hall , Inc. 1996, ISBN: 0-13-376658-6. (CS)
SZENDIUCH, Ivan. Základy technologie mikroelektronických obvodů a systémů. Brno: VUTIUM, 2006. ISBN 80-214-3292-6. (CS)
ŠADNERA, Josef. Návrh plošných spojů pro povrchovou montáž. Technická literatura BEN, Praha 2006. (CS)
ŠANDERA, Josef, STARÝ, Jiří. Mikroelektronické praktikum. 2019, elektronický výukový text. (CS)
ŠAVEL Josef. Materiály technologie a výroba v elektronice a elektrotechnice. BEN technická literatura, Praha 2004, ISBN – 7300 -154 -3. (CS)
ZÁHLAVA, Vít. Metodika návrhu plošných spojů. skriptum ČVUT, Vydavatelství ČVUT, srpen 2000, ISBN 80-01-02193-9. (CS)

Recommended reading

Not applicable.

Classification of course in study plans

  • Programme BPC-AUD Bachelor's

    specialization AUDB-TECH , 3 year of study, summer semester, compulsory-optional
    specialization AUDB-ZVUK , 0 year of study, summer semester, elective

  • Programme BPC-ECT Bachelor's 0 year of study, summer semester, elective
  • Programme BPC-MET Bachelor's 2 year of study, summer semester, compulsory-optional
  • Programme BPC-SEE Bachelor's 0 year of study, summer semester, elective
  • Programme BPC-TLI Bachelor's 0 year of study, summer semester, elective

Type of course unit

 

Lecture

12 hod., optionally

Teacher / Lecturer

Syllabus

- Návrh plošných spojů.

- Vlastnosti materiálů používaných v elektrotechnice.

- Snímače teploty v elektrotechnice.

- Kontrukce zařízení.

- Řešení technologických problémů.

- Mechanické opracování dílů.

- Předpis pracovního postupu.

- Výrobní legislativa.

 

Laboratory exercise

39 hod., compulsory

Teacher / Lecturer

Syllabus

- Návrh plošných spojů (modul Barevná hudba).

- Rozpoznávání základních plastů.

- Výroba termočlánků a úskalí při měření.

- Pájení jednoduchých i složitějších komponent.

- Kontrukce modulu Barevná hudba.